Patents by Inventor Lavanya Bharadwaj

Lavanya Bharadwaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Component and Process of Producing Electronic Component
    Publication number: 20170326841
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
    Type: Application
    Filed: July 28, 2017
    Publication date: November 16, 2017
    Applicants: TE Connectivity Corporation, TE Connectivity Germany GmbH
    Inventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
  • Electronic Component and Process of Producing Electronic Component
    Publication number: 20170100916
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicants: Tyco Electronics Corporation, TE Connectivity Germany GmbH
    Inventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
  • Electronic Component and Process of Producing Electronic Component
    Publication number: 20170100744
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Shallu Soneja, Min Zheng, Dov Nitzan, Lavanya Bharadwaj, Barry C. Mathews, Michael A. Oar, Gokce Gulsoy