Patents by Inventor Lawrence Daniel David

Lawrence Daniel David has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 6358439
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: March 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 6124041
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: September 26, 2000
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 5925443
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: July 20, 1999
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall