Abstract: According to one embodiment of the invention, a method for preventing the failure of a system, which includes one or more pipes, or one or more cooling jackets, or one or more fluid cooled system components carrying a fluid, involves detecting one or more pressure levels of the fluid in the one or more pipes at one or more points, then comparing the detected pressure levels to a corresponding one or more predetermined limitation values. If the detected pressure levels exceed the corresponding limitation values, a shut-down signal is generated. The shut-down signal triggers the adjusting of one or more systems responsible for causing thermal variations of the fluid, preventing the system from failing while allowing the system to continue operation shortly thereafter.

Abstract: According to one embodiment of the invention, a method for preventing the failure of a system, which includes one or more pipes, or one or more cooling jackets, or one or more fluid cooled system components carrying a fluid, involves detecting one or more pressure levels of the fluid in the one or more pipes at one or more points, then comparing the detected pressure levels to a corresponding one or more predetermined limitation values. If the detected pressure levels exceed the corresponding limitation values, a shut-down signal is generated. The shut-down signal triggers the adjusting of one or more systems responsible for causing thermal variations of the fluid, preventing the system from failing while allowing the system to continue operation shortly thereafter.

Abstract: According to one embodiment of the invention, a method for preventing the failure of a system, which includes one or more pipes, or one or more cooling jackets, or one or more fluid cooled system components carrying a fluid, involves detecting one or more pressure levels of the fluid in the one or more pipes at one or more points, then comparing the detected pressure levels to a corresponding one or more predetermined limitation values. If the detected pressure levels exceed the corresponding limitation values, a shut-down signal is generated. The shut-down signal triggers the adjusting of one or more systems responsible for causing thermal variations of the fluid, preventing the system from failing while allowing the system to continue operation shortly thereafter.

Abstract: According to one embodiment of the invention, a method for preventing the failure of a system, which includes one or more pipes, or one or more cooling jackets, or one or more fluid cooled system components carrying a fluid, involves detecting one or more pressure levels of the fluid in the one or more pipes at one or more points, then comparing the detected pressure levels to a corresponding one or more predetermined limitation values. If the detected pressure levels exceed the corresponding limitation values, a shut-down signal is generated. The shut-down signal triggers the adjusting of one or more systems responsible for causing thermal variations of the fluid, preventing the system from failing while allowing the system to continue operation shortly thereafter.

Abstract: A method for high speed bonding of fine wires to electrodes includes a method of teaching the wire bonding tool the exact point of engagement of the bonding tool with the semiconductor. The bonding position point of engagement is employed to calculate a tolerance inflection point representative of the point in space where the bonding tool must start a constant velocity approach to the first bonding position. In similar manner, the point of engagement of the bonding tool with the semiconductor is determined and from that position a reset point is calculated representative of point in space where the bonding tool will start its rapid decelleration approach to the tolerance inflection point. The bonding tool may then be acceleration toward the bonding position with optimum speed without crashing into the semiconductor.

Abstract: A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode, the bonding tool is moved toward the electrode at a substantially linear predetermined velocity so that the bonding tool imparts a controlled kinetic energy to the wire as a first bonding force, a second predetermined preload bonding force is applied to the bonding tool at the time of engagement and subsequently a third and final predetermined bonding force is applied to the bonding tool to bond the fine wire to the electrode at high speeds.

Abstract: An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into the processor for different semiconductor devices or workpieces. Indicating means are provided on the novel bonding head for establishing the reset position and the bonding positions so that the bonding tool is taught a series of predetermined vertical positions during a bonding cycle. The apparatus is also programmed to compute intermediate positions between said predetermined vertical positions to obtain optimum high speed movement of the bonding head and the bonding tool during subsequent bonding cycles.

Abstract: An automatic gain control system has a multiplying circuit for multiplying levels of input and feedback signals. Such control system is provided with a closed loop homomorphic network connected between the output terminal of the control system and the feedback terminal of the multiplying circuit. Such homomorphic network maintains a compressed output signal level at the system's output terminal, inhibits oscillation and latching up of the main system in which this AGC system is a component, and provides low distortion and noise levels of signals processed by this AGC system.