Patents by Inventor Lawrence R. Poglitsch

Lawrence R. Poglitsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6740824
    Abstract: A ground connector assembly (20) having a substrate (22) and a ground member (24). The substrate (22) is used to retain an electrical circuit and has a ground region (34), a ground hole (30), and at least one strain relief slot (32). The ground member (24) is attached within the ground hole (30). The ground region (34) surrounds the ground hole (30) and is at least partially interposed between the ground hole (30) and the strain relief slot (32). The ground connector assembly (20) may further include a conductive ring (42), such as a copper ring, surrounding the ground hole (30) and attached to the ground region (34). There is also a method of making the ground connector assembly (20).
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: May 25, 2004
    Assignee: Motorola, Inc.
    Inventors: Lawrence R. Poglitsch, Ronald Li, Alan S. Kang, Todd Ringa, Steven G. Sharkey, Rick Cihak
  • Publication number: 20030234117
    Abstract: A ground connector assembly (20) having a substrate (22) and a ground member (24). The substrate (22) is used to retain an electrical circuit and has a ground region (34), a ground hole (30), and at least one strain relief slot (32). The ground member (24) is attached within the ground hole (30). The ground region (34) surrounds the ground hole (30) and is at least partially interposed between the ground hole (30) and the strain relief slot (32). The ground connector assembly (20) may further include a conductive ring (42), such as a copper ring, surrounding the ground hole (30) and attached to the ground region (34). There is also a method of making the ground connector assembly (20).
    Type: Application
    Filed: June 25, 2002
    Publication date: December 25, 2003
    Inventors: Lawrence R. Poglitsch, Ronald Li, Alan S. Kang, Todd Ringa, Steven G. Sharkey, Rick Cihak
  • Patent number: 6053049
    Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: April 25, 2000
    Assignee: Motorola Inc.
    Inventors: Chiu Chik Chen, Christopher J. Hoyle, Robert C. Kosberg, Keith A. Meny, Lawrence R. Poglitsch, James Nowicki, Jr.
  • Patent number: 4928376
    Abstract: A method for oil filling an internal pressure sensor cavity (20) is disclosed which minimizes manufacturing process time and insures totally and properly filling the internal cavity with oil. A predetermined amount of oil (23) is added to a pressure sensor external cavity (21) connected through an opening (22) to an internal sensor cavity (20) having a sensing element (17) therein. A vacuum is drawn while the oil is in the external cavity thus providing at least a partial vacuum in at least the internal cavity. Then vacuum pressure is released causing the oil to be drawn into the internal cavity through the opening. Subsequently a sealing means (27) is force fit in the opening to seal the internal cavity.
    Type: Grant
    Filed: July 31, 1989
    Date of Patent: May 29, 1990
    Assignee: Motorola Inc.
    Inventor: Lawrence R. Poglitsch