Patents by Inventor Lawrence Tom
Lawrence Tom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7259548Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: January 7, 2005Date of Patent: August 21, 2007Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Patent number: 7180284Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 4, 2005Date of Patent: February 20, 2007Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Publication number: 20060261833Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: July 24, 2006Publication date: November 23, 2006Inventors: Timothy Boyle, Wayne Richter, Ladd Johnson, Lawrence Tom
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Patent number: 7098649Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: June 17, 2004Date of Patent: August 29, 2006Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Publication number: 20060119346Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: October 4, 2005Publication date: June 8, 2006Inventors: Timothy Boyle, Wayne Richter, Ladd Johnson, Lawrence Tom
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Patent number: 7002337Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: July 27, 2004Date of Patent: February 21, 2006Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Publication number: 20050116731Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: January 7, 2005Publication date: June 2, 2005Inventors: Timothy Boyle, Wayne Richter, Ladd Johnson, Lawrence Tom
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Patent number: 6861859Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: March 1, 2005Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Publication number: 20040263153Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: July 27, 2004Publication date: December 30, 2004Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Publication number: 20040232928Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: June 17, 2004Publication date: November 25, 2004Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Patent number: 6781394Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: August 24, 2004Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
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Patent number: 6771060Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: August 3, 2004Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
