Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Abstract: A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

Abstract: A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.

Abstract: An optical device may include a substrate and an optical waveguide carried by the substrate and having a notch therein defining a feed optical waveguide and a longitudinal optical waveguide section on opposite longitudinal sides of the notch. The optical device may also include a transverse optical waveguide section carried by the substrate and transversely aligned with the feed optical waveguide adjacent the notch. The optical device may further include an elastomeric waveguide switch body configured to be moved between a first position within the notch and operative to switch light from the feed optical waveguide to the longitudinal optical waveguide section, and a second position removed from the notch and operative to switch light from the optical waveguide to the transverse optical waveguide section.

Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding.

Abstract: An electro-optical device may include a substrate having opposing first and second surfaces and an opening extending therebetween. The optical device may also include an optical waveguide extending laterally along the first surface and having an end aligned with the opening, and an electro-optical component carried by the second surface and aligned with the opening. The electro-optical device may further include an elastomeric body within the opening and having a first end face adjacent the optical waveguide and having a second end face adjacent the electro-optical component. The elastomeric body and the optical waveguide may have respective gradient refraction indices within ±5% of each other.

Abstract: An optical fiber switch which may include first and second angled optical fibers having respective first and second end faces. Each of the first and second angled optical fibers may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction less than the core index of refraction. The optical fiber switch may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core. The optical fiber switch may also include at least one actuator for relatively moving the first and second angled optical fibers between a coupled position and an uncoupled position.

Abstract: An optical fiber switch which may include first and second angled optical fibers having respective first and second end faces. Each of the first and second angled optical fibers may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The optical fiber switch may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding. The optical fiber switch may also include at least one actuator for relatively moving the first and second angled optical fibers between a coupled position and an uncoupled position.

Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core.

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a battery component receiving recess. The multilayer circuit board may include at least one pair of liquid crystal polymer (LCP) layers, and at least one electrically conductive pattern layer on at least one of the LCP layers and defining at least one battery electrode adjacent to the battery component receiving recess. The electronic device may further include a battery component within the battery component receiving recess and coupled to the at least one battery electrode to define a battery.

Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core.

Abstract: A method for making an optical device may include applying at least one precursor for a curable index matching elastomeric solid layer onto an end face of an optical waveguide device. The optical waveguide device may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The method may further include curing the at least one precursor to form the index matching elastomeric solid layer on the end face to have an index of refraction matching the index of refraction of at least the core.

Abstract: An optical fiber switch which may include first and second angled optical fibers having respective first and second end faces. Each of the first and second angled optical fibers may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction less than the core index of refraction. The optical fiber switch may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core. The optical fiber switch may also include at least one actuator for relatively moving the first and second angled optical fibers between a coupled position and an uncoupled position.

Abstract: An optical fiber switch which may include first and second angled optical fibers having respective first and second end faces. Each of the first and second angled optical fibers may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The optical fiber switch may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding. The optical fiber switch may also include at least one actuator for relatively moving the first and second angled optical fibers between a coupled position and an uncoupled position.

Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding.

Abstract: A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a battery component receiving recess. The multilayer circuit board may include at least one pair of liquid crystal polymer (LCP) layers, and at least one electrically conductive pattern layer on at least one of the LCP layers and defining at least one battery electrode adjacent to the battery component receiving recess. The electronic device may further include a battery component within the battery component receiving recess and coupled to the at least one battery electrode to define a battery.

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

Abstract: An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.