Abstract: An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. To use the above generic subassembly as the chip holding subassembly, an electrical components on the first face of the substrate include sockets which hold the chips that are tested. To use the above generic subassembly as the power converter subassembly, the electrical components on the first face of the substrate include electrical power converters for the chips that are tested.

Abstract: An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. Distributed on the first face of the substrate are a plurality of electrical components that are used in testing the chips; and, distributed on the second face of the substrate are a plurality of electrical contacts which are connected through the substrate to the electrical components on the first face. These electrical contacts get pressed against mating contacts, and they carry all electrical power and all electrical signals for the chips that are tested.

Abstract: An electromechanical apparatus for testing integrated chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly, which are squeezed together in multiple sets, by respective pressing mechanisms. One benefit which is achieved with this electromechanical apparatus is that by pressing the temperature regulating subassembly against the chip holding subassembly, heat can be added/removed from the chips by conduction; and thus the temperature of the chips can be regulated accurately. Another benefit which is achieved with this electromechanical apparatus is that by pressing the power converter subassembly against the chip holding subassembly, the distance between the chips that are tested and the power supplies for those chips is made small. Consequently, the chip voltages can easily be kept constant while the chip power dissipation changes rapidly as the chips are tested.

Abstract: A mechanical assembly for regulating the temperature of a chip is comprised of a heat exchanger which has a face for mating with a planar surface on the chip. A frame is coupled to the heat exchanger such that the face of the heat exchanger is exposed and can contact the planar surface of the chip. And, the face of the heat exchanger has a shape which makes contact with the entire planar surface on the chip except for each of its corners. One particular embodiment of the heat exchanger has four grooves which extend from the face and which respectively align with the corners of the chip. Due to those grooves, initial contact between the face on the heat exchanger and the planar surface on the chip occurs on an edge of the chip which is spaced-apart from a corner. Consequently, the chance of breaking the tip of a corner off of the chip is reduced.