Patents by Inventor Lea Wayne

Lea Wayne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120269468
    Abstract: A flexible packaging structure has built-in opening features in a laminate with a first structure adhesively joined to a second structure. A tear area is formed by laser ablation of the laminate along a junction between the first and second portions preferably prior to assembling the laminate into the package. Laser ablation begins at the center of the tear area and progressively moves the laser in a direction radially outward from the center of the tear area. During assembly of the package, a seal is formed between end portions of the first and second portions of the laminate. A score line and a sealant reduction area are also introduced to the package to facilitate opening. The package is opened by pulling the seal near the tear area in a direction along the score line until the contents of the package are accessible.
    Type: Application
    Filed: July 2, 2012
    Publication date: October 25, 2012
    Applicant: SONOCO DEVELOPMENT, INC.
    Inventors: John Prizzi, Barry R. Reese, Lea Wayne
  • Patent number: 8230664
    Abstract: A flexible packaging structure has built-in opening features in a laminate with a first structure adhesively joined to a second structure. A tear area is formed by laser ablation of the laminate along a junction between the first and second portions preferably prior to assembling the laminate into the package. Laser ablation begins at the center of the tear area and progressively moves the laser in a direction radially outward from the center of the tear area. During assembly of the package, a seal is formed between end portions of the first and second portions of the laminate. A score line and a sealant reduction area are also introduced to the package to facilitate opening. The package is opened by pulling the seal near the tear area in a direction along the score line until the contents of the package are accessible.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: July 31, 2012
    Assignee: Sonoco Development, Inc.
    Inventors: John Prizzi, Barry R. Reese, Lea Wayne
  • Publication number: 20100021672
    Abstract: A flexible packaging structure has built-in opening features in a laminate with a first structure adhesively joined to a second structure. A tear area is formed by laser ablation of the laminate along a junction between the first and second portions preferably prior to assembling the laminate into the package. Laser ablation begins at the center of the tear area and progressively moves the laser in a direction radially outward from the center of the tear area. During assembly of the package, a seal is formed between end portions of the first and second portions of the laminate. A score line and a sealant reduction area are also introduced to the package to facilitate opening. The package is opened by pulling the seal near the tear area in a direction along the score line until the contents of the package are accessible.
    Type: Application
    Filed: July 28, 2008
    Publication date: January 28, 2010
    Inventors: John Prizzi, Barry R. Reese, Lea Wayne