Patents by Inventor Leatrice Lea Gallman Adams

Leatrice Lea Gallman Adams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal conduction by encapsulation
    Patent number: 7898724
    Abstract: A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: March 1, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Jane Qian Liu, Frank Armstrong, Edward Carl Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams
  • THERMAL CONDUCTION BY ENCAPSULATION
    Publication number: 20100110527
    Abstract: A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 6, 2010
    Applicant: Texas Instruments Incorporated
    Inventors: Jane Qian Liu, Frank Armstrong, Edward Carl Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams