Abstract: An apparatus is for holding a circuit board having components attached to a top surface and to a bottom surface of the circuit board. The apparatus includes a structure having at least two sides, each of which has a ledge that protrudes from a side of the structure for supporting the circuit board. The ledge has a height that exceeds a distance between the circuit board and a bottom of a first component mounted on the bottom surface of the circuit board such that structure suspends the first component above a surface holding the structure.

Abstract: A wave solder machine is provided which includes an endless moving mesh belt that is made of a nonsolderable material such as titanium wire. The belt is supported so as to be totally immersed in the solder wave as it passes the latter. This causes the undersides of stuffed printed circuit boards on the belt to be brought into contact with the molten solder. The belt wires preferably have a plurality of projections thereon to support the circuit boards above the major portion of the belt. In another machine, the circuit boards are moved along a plurality of parallel wires that pass through the solder wave. Alternatively, the wires themselves may be moving for carrying circuit boards across the solder wave.