Patents by Inventor Lee C. Kresge

Lee C. Kresge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material
    Patent number: 10813228
    Abstract: Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: October 20, 2020
    Assignee: INDIUM CORPORATION
    Inventors: Lee C. Kresge, Elaina J. Zito, Ning-Cheng Lee
  • PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS VIA UTILIZATION OF ADHESIVE MATERIAL
    Publication number: 20190394883
    Abstract: Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventors: Lee C. Kresge, Elaina J. Zito, Ning-Cheng Lee