Abstract: An integrated circuit (100) has an input (110) for receiving an externally applied power supply voltage. Internal to the integrated circuit, a pass transistor (104) conveys the supply voltage to an internal supply node (120) which supplies the operating circuitry (102) of the integrated circuit. The pass transistor has a relatively low threshold voltage for operation at reduced supply voltage, such as 1.0 volt. The pass transistor is controlled by an enable signal received at an input (112) and by a charge pump (106). In a standby mode, the charge pump raises the voltage on the gate of the pass transistor to fully turn off the pass transistor and minimize standby current.

Abstract: A voltage boost circuit (111) for a flash memory (100) includes a boosting circuit (110), which is capable of boosting a portion of a power supply voltage (VCC) of the flash memory to a word line voltage level adequate for accessing a core cell in a core cell array (102) of the memory. The voltage boost circuit further includes a balancing or clamping circuit (112) for providing a nonzero adjustment voltage (VCL) to the boosting circuit to reduce the portion of the supply voltage that is available for boosting by the boosting circuit when the power supply voltage exceeds a certain value.

Abstract: A flash memory device (100) includes a core cell array including two banks (194, 196) of core cells and address decoding circuitry (112, 114, 118, 120) and a write protect circuit. The write protect circuit includes sector write protect circuits (210) associated with respective sectors (202) of the core cell array in storing write protect data for the associated sector. The write protect circuit further includes a switch circuit (404) which selects one sector write protect signal in response to a write select signal to produce a combined write protect signal. The write protect circuit further includes an output circuit (406) coupled to the switch circuit to produce a sector write protect signal.

Abstract: A voltage boost circuit (111) for a memory (100) includes a boosting circuit (110) which is coupled to a boosted node (120) to boost a word line voltage for accessing a core cell of the memory. The voltage boost circuit further includes a reset circuit (112) coupled to the boosted node and including a switchable zero-threshold transistor (202) for resetting the boosted node to a reset voltage (VCC).

Abstract: An address buffering and decoding architecture for a multiple bank (or N bank) simultaneous operation flash memory is described. For the duration of a read operation at one bank of the N banks, a write operation can only be performed on any one of the other N-1 banks. For the duration of a write operation at one bank of the N banks, a read operation can only be performed on any one of the other N-1 banks. The address buffering and decoding architecture includes a control logic circuit, an address selection circuit located at each of the N banks, and address buffer circuitry. The control logic circuit is used to generate N read select signals to select one bank of the N banks for a read operation and N write select signals to select another bank of the N banks for a write operation. Each address selection circuit is configured to receive from the control logic circuit a respective one of the N read select signals and a respective one of the N write select signals.

Abstract: A memory integrated circuit (100) includes an array (102) of core cells (202) addressable by a plurality of word lines (120) and a plurality of drain lines (122). Address circuitry selects one or more word lines and one or more drain lines. Sensing circuit (110) senses a data state of one or more selected core cells of the array of core sells. Drain line charging circuitry charges one or more drain lines prior to sensing this data state. The drain line charging circuitry includes a rapid charging circuit (230) for precharging the one or more drain lines to the predetermined voltage during a precharge period, and a final charging circuit (214) for charging the one or more drain lines to a final charge voltage for sensing the data state.

Abstract: An integrated circuit (100) includes a first input (108) to receive a first operating voltage Vcc and a second input (110) to receive a second operating voltage Vss. Operating circuitry (102) of the integrated circuit is coupled to the first input to power the operating circuitry. A transistor (104) is coupled between the second input and the operating circuitry to selectively provide the second operating voltage to the operating circuitry of the integrated circuit. The well containing the transistor is biased to provide a reverse body effect and reduce the threshold voltage of the transistor to allow operation at very low Vcc.

Abstract: A memory device (100) includes a core cell array (102), a sense amplifier circuit (110), data lines (120), each having a length. The memory device further includes bit lines (118) extending from the core cell array and a selection circuit (106) configured to selectively couple a bit line to a data line in response to an input address. Bias circuits (130) are distributed along the length of the data lines and are configured to apply an initial voltage to the data line, reducing the read access time of the memory device. The bias circuits 130 may be positioned to accommodate varying lengths of the data lines and varying capacitance of the data lines.