Patents by Inventor Lee Francis

Lee Francis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159771
    Abstract: Disclosed are methods and systems using liquid chromatography/tandem mass spectrometry (LC-MS/MS) for the analysis of endogenous biomarkers isolated from biological samples. In certain embodiments, the samples comprise dried body fluids such as dried plasma.
    Type: Application
    Filed: September 29, 2023
    Publication date: May 16, 2024
    Applicant: Laboratory Corporation of America Holdings
    Inventors: Christopher Michael Shuford, Russell Philip Grant, Meghan Norris Bradley, Patricia Louise Miller Holland, Michael Levandoski, Matthew Lee Francis Crawford, Bradley Collier
  • Patent number: 11984254
    Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Lee Francis, William Jarvis, Takayuki Tange
  • Patent number: 11978581
    Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: May 7, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Lee Francis, William Jarvis, Takayuki Tange, Shouhei Hirose
  • Publication number: 20240129299
    Abstract: Authentication request notifications are selectively suppressed, reducing notification fatigue and susceptibility to social engineering attacks. Authentication request notifications may be suppressed by not presenting a push notification on the user's phone. The authentication request may still be accessed and approved by manually opening the authenticator app. Notifications may be suppressed based on an estimation that the person attempting to login is not who they say they are. This estimation may be based on applying heuristics and/or machine learning models to the context of the login attempt, such as the IP address that originated the login request, time of day, recent user actions, patterns of previous logins, etc. One heuristic determines that the user has repeatedly ignored notifications caused by a particular IP address. Machine learning models generate a risk score from the login context, and notifications may be suppressed if the risk score exceeds a threshold.
    Type: Application
    Filed: December 27, 2022
    Publication date: April 18, 2024
    Inventors: Poulomi BANDYOPADHYAY, Rajat LUTHRA, Lee Francis WALKER, Zachary Michael EDWARDS, Colin TRENT
  • Publication number: 20240055178
    Abstract: An electronic module includes a substrate or a lead frame including primary conductive patterns and secondary conductive patterns; a magnetic core; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, first terminals that define a first terminal group and that are on or embedded in the resin body, and second terminals that define a second terminal group and that on or are embedded in the resin body; an IC; and a capacitor. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected corresponding secondary conductive patterns; and a first primary conductive pattern is closer to a second primary conductive pattern than any of the secondary conductive patterns.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 15, 2024
    Inventors: Takayuki TANGE, Lee FRANCIS, Scott Andrew PARISH, Rohit SIDAPARA
  • Publication number: 20240055177
    Abstract: A magnetic component includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above of the substrate or the lead frame; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern, and a second terminal on or embedded in the resin body and that is connected to the secondary conductive pattern; and an insulating material covering the substrate or the lead frame, the magnetic core, and the block coil.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 15, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki TANGE, Lee FRANCIS, Scott Andrew PARISH, Rohit SIDAPARA
  • Patent number: 11894176
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are covered with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: February 6, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Scott Andrew Parish, Lee Francis
  • Publication number: 20230420175
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
    Type: Application
    Filed: September 6, 2023
    Publication date: December 28, 2023
    Inventors: Scott Andrew PARISH, Lee FRANCIS
  • Publication number: 20230422400
    Abstract: A device includes a substrate including a cavity, a magnetic core in the cavity, a first winding extending around the magnetic core, and a single channel that extends between the cavity and an exterior of the device and that defines an opening. The first winding includes vias along an exterior periphery of the magnetic core opposite to the channel.
    Type: Application
    Filed: November 5, 2021
    Publication date: December 28, 2023
    Inventors: Takayuki TANGE, Neil STEPHENSON, Lee FRANCIS
  • Patent number: 11792919
    Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lee Francis
  • Publication number: 20230178286
    Abstract: A pin has a z shape and includes a first notch in a first tip of the pin and a first slot in a first bend in the pin. Alternatively, a pin includes first, second, and third plates; a first bend connecting the first and the second plates; a second bend connecting the second and the third plates. The first plate includes a first notch, and the second bend includes a first slot. A module includes a substrate, a pin mounted to the substrate, and a wire wound around the pin.
    Type: Application
    Filed: June 10, 2021
    Publication date: June 8, 2023
    Inventor: Lee FRANCIS
  • Publication number: 20230178296
    Abstract: A transformer assembly includes a substrate, a surface-mounted header on the substrate, a core on the surface-mounted header and including a U-shaped portion and I-shaped portion, and first and second bobbins on two legs of the U-shaped portion of the core.
    Type: Application
    Filed: June 10, 2021
    Publication date: June 8, 2023
    Inventors: Lee FRANCIS, Peter CHEUNG
  • Publication number: 20230178285
    Abstract: A transformer assembly includes a transformer core, a cup that receives the transformer core, a lid that engages with the cup and covers the transformer core, and a winding wound around the cup and the lid. The cup and/or the lid include at least one hole through which the transformer core is exposed to an exterior of the cup and the lid when the lid is engaged with the cup.
    Type: Application
    Filed: June 10, 2021
    Publication date: June 8, 2023
    Inventors: Lee FRANCIS, Jamie HARBER
  • Publication number: 20230178292
    Abstract: A pin includes a head, a base connected to the head, a tail connected to the base, and clasps extending from the tail. The head includes two or more of the following: a hook, a first side notch, a second side notch, and an end notch. A module includes a substrate, a first pin mounted to the substrate at a first location, and a second pin mounted to the substrate at a second location. A distance between a tip of the first pin and a tip of the second pin is greater than a distance between the first location and the second location.
    Type: Application
    Filed: June 10, 2021
    Publication date: June 8, 2023
    Inventor: Lee FRANCIS
  • Patent number: 11651312
    Abstract: Disclosed embodiments include a method for combining a BATCH application programming interface (API) and a QUEUEABLE API on a SALESFORCE platform to process records. The method can include accessing a programming environment associated with an add-on application for a SALESFORCE platform, obtaining records via the add-on application to be processed on the SALESFORCE platform in accordance with a job type, calling a BATCH API to process the records by batching the records to create job records, and calling a QUEUEABLE API to process the job records in QUEUEABLES including parallel QUEUEABLES such that at least some job records included in the parallel QUEUEABLES are processed in parallel in accordance with the job type.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: May 16, 2023
    Assignee: FinancialForce.com, Inc.
    Inventor: Lee Francis Storey
  • Publication number: 20220398741
    Abstract: The present disclosure is concerned with a computer implemented method for segmenting an image including a plurality of pixels. The method includes: processing the image to generate a first trimap and a second trimap, each trimap segmenting each pixel of the image into either a foreground region, a background region or an unknown region; performing a reconciliation algorithm on the first trimap and the second trimap to yield a merged trimap; processing the merged trimap and image to yield an alpha matte, the alpha matte including an alpha value for at least each pixel in the unknown region; and applying the alpha matte to the image to remove the background region therefrom.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 15, 2022
    Inventor: Lee Francis David Penkman
  • Publication number: 20220310300
    Abstract: A magnetic-component module includes a first header, a core on the first header, and a winding including a first trace on the first header. The first header includes a disc-shaped portion that supports the core and a cylinder-shaped portion that receives a hole of the core.
    Type: Application
    Filed: July 9, 2020
    Publication date: September 29, 2022
    Inventor: Lee FRANCIS
  • Patent number: 11442073
    Abstract: Disclosed are methods and systems for measuring serotonin in a sample using liquid chromatography and mass spectrometry.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: September 13, 2022
    Assignee: Laboratory Corporation of America Holdings
    Inventors: Matthew Lee Francis Crawford, Yvonne Zamorano Wright, Russell Philip Grant
  • Publication number: 20220132657
    Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.
    Type: Application
    Filed: March 13, 2020
    Publication date: April 28, 2022
    Inventor: Lee FRANCIS
  • Patent number: 11282631
    Abstract: A magnetic core is situated in a cavity routed into an insulating substrate. The cavity and magnetic core are coved with a first insulating layer. Through holes are then formed through the first insulating layer and the insulating substrate, and plated to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a second set of the outer conductive vias, are spaced farther from the cavity than a first set, and have greater via hole diameter than the vias in the first set. This reduces the resistance of the windings for a given substrate size and improves the performance of the device.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lee Francis