Patents by Inventor Leeku KWAC

Leeku KWAC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11753722
    Abstract: Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: September 12, 2023
    Assignees: JEONJU UNIVERSITY OFFICE OF INDUSTRY-UNIVERSITY COOPERATION
    Inventors: Hong-gun Kim, Hun Jeong, Leeku Kwac, Seonghun Back, Bobby Singh Soram
  • Publication number: 20210246558
    Abstract: Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.
    Type: Application
    Filed: February 11, 2021
    Publication date: August 12, 2021
    Inventors: Hong-gun KIM, Hun JEONG, Leeku KWAC, Seonghun BACK, Bobby Singh SORAM