Patents by Inventor Leesa Marle Noujelm

Leesa Marle Noujelm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10490907
    Abstract: A phased-array antenna includes an antenna layer of a stacked printed circuit board, a ground plane layer of the stacked printed circuit board spaced apart from the antenna layer, and a first dielectric layer of the stacked printed circuit board disposed between and in opposed contact with the antenna layer and the ground plane layer. The antenna layer includes an associated metal patch pattern defined by a series of slots. The stacked printed circuit board defines a thickness extending between a top end of the stacked printed circuit board and a bottom end of the stacked printed circuit board. The phased-array antenna includes a series of ground vias extending between the top and bottom ends of the stacked printed circuit board. The ground vias are configured to suppress surface waves propagating across the stacked printed circuit board.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: November 26, 2019
    Assignee: Google LLC
    Inventors: Arnold Feldman, Leesa Marle Noujelm, Michael J. Buckley
  • Publication number: 20180090851
    Abstract: A phased-array antenna includes an antenna layer of a stacked printed circuit board, a ground plane layer of the stacked printed circuit board spaced apart from the antenna layer, and a first dielectric layer of the stacked printed circuit board disposed between and in opposed contact with the antenna layer and the ground plane layer. The antenna layer includes an associated metal patch pattern defined by a series of slots. The stacked printed circuit board defines a thickness extending between a top end of the stacked printed circuit board and a bottom end of the stacked printed circuit board. The phased-array antenna includes a series of ground vias extending between the top and bottom ends of the stacked printed circuit board. The ground vias are configured to suppress surface waves propagating across the stacked printed circuit board.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 29, 2018
    Applicant: Google Inc.
    Inventors: Arnold Feldman, Leesa Marle Noujelm, Michael J. Buckley