Abstract: The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.

Abstract: A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.

Abstract: The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

Abstract: The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical extensions and the chip is directly bonded to these extensions. The invention also relates to an electric device comprising at least one chip and an external electric circuit. The chip is directly bonded to physical extensions of conductors of the external electric circuit.

Abstract: The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

Abstract: A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.

Abstract: The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical extensions and the chip is directly bonded to these extensions. The invention also relates to an electric device comprising at least one chip and an external electric circuit. The chip is directly bonded to physical extensions of conductors of the external electric circuit.

Abstract: An apparatus includes chip and a carrier of the chip. A ridge is positioned between the chip and the carrier. The ridge is adapted to increase thermal contact between the chip and the carrier. The chip is attached to a contact surface on the carrier by an adhesive member.

Abstract: A microwave unit comprising a motherboard and a package adapted to be assembled automatically in, e.g., a Surface Mounted Device, SMD, machine is disclosed. The microwave unit preferably comprises a connecting component interconnecting the motherboard and the package, and operable to make the signal ways on a same level at both the motherboard and at the package. Furthermore, the microwave unit preferably comprises a micro-strip adapted soldering tag for soldering on two sides.

Abstract: The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

Abstract: A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.

Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

Abstract: The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

Abstract: The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

Abstract: Printed circuit board (1, 2, 3) comprising at least a first layer (13) on which a first stationary contact terminal (18) is formed and one or more second layers (9, 22) being spaced apart from the first layer (13) by at least one intermediate layer (10, 11, 12) is shown, whereby at least a portion (5) of said one or more second layers (11, 12) extend into a recess (26) formed by at least a discontinuity of the intermediate layers (10, 11, 12). The portion in the printed circuit board is flexible and has a second terminal (6). Which can be brought into contact with the first stationary terminal (20).

Abstract: The invention relates to a microwaveguide that is integrated in the dielectric layer of a conductor carrier, e.g. a printed circuit board. The waveguide enables different types of active and/or passive functions intended to influence the signals sent through the waveguide to be integrated at appropriate positions in the waveguide.

Abstract: The invention relates to a process for manufacturing a structure (100) for a circuit board which comprises a plurality of supporting layers (10, 30, 60, 90), all of different materials, which supporting layers (10, 30, 60, 90) support electrically conducting patterns (20, 50, 70, 120). According to the process, the material for a first supporting layer (10) is that material which has the highest melting point of the different materials for supporting layers, subsequent to which, beginning from the first supporting layer (10), new supporting layers (30, 60, 90) are arranged successively. As material for each new supporting layer (30, 60, 90), a material is chosen with lower melting point than the supporting layer which is closest in the direction of the first supporting layer (10).

Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index &egr;r than the dielectric material.