Patents by Inventor Lejie Liu

Lejie Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133945
    Abstract: A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Mohanraj Prabhugoud, David Shia, Lejie Liu, Silver Alfonso Rodriguez Estrada, Min Pei, Ralph V. Miele, Caleb Million Tessema
  • Patent number: 11923861
    Abstract: A voltage controlled oscillator (VCO), including: at least one second upper voltage rail; at least one second lower voltage rail; a ring of N cascaded inverters, wherein the set of N cascaded inverters are coupled between the at least one second upper voltage rail and the at least one second lower voltage rail; at least one first frequency band select circuit coupled between first upper voltage rail and the at least one second upper voltage rail; at least one second frequency band select circuit coupled between the at least one second lower voltage rail and first lower voltage rail; at least one first VCO frequency control circuit coupled between the first upper voltage rail and the at least one second upper voltage rail; and at least one second VCO frequency control circuit coupled between the at least one second lower voltage rail and the first lower voltage rail.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: March 5, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Hao Liu, Lejie Lu, Yu Song, Dong Ren