Abstract: A tote accumulator includes stack retaining latches that are configured to be acted on by a cam and follower mechanism and additionally by a holding mechanism. The cam and follower mechanism is configured to act on the stack retaining latches when the stack of totes is moved vertically by a lifting member, to move the stack retaining latches into an active dwell wherein the stack retaining latches are engaged with the stack of totes. The holding mechanism is configured to be activated to extend the active dwell after the cam and follower mechanism ceases to act on the stack retaining latches. The active dwell is extended even further by a mechanical interlocking feature between the latches and the totes. In various implementations, the design of the cam and follower arrangement and the activation timing of the holding mechanism may be adapted to execute a stacking or an unstacking operation.

Abstract: A tote accumulator includes stack retaining latches that are configured to be acted on by a cam and follower mechanism and additionally by a holding mechanism. The cam and follower mechanism is configured to act on the stack retaining latches when the stack of totes is moved vertically by a lifting member, to move the stack retaining latches into an active dwell wherein the stack retaining latches are engaged with the stack of totes. The holding mechanism is configured to be activated to extend the active dwell after the cam and follower mechanism ceases to act on the stack retaining latches. The active dwell is extended even further by a mechanical interlocking feature between the latches and the totes. In various implementations, the design of the cam and follower arrangement and the activation timing of the holding mechanism may be adapted to execute a stacking or an unstacking operation.

Abstract: Methods and tools for opening polyfilm-wrapped packages. A tool includes a rubbing surface and a motor configured to move the rubbing surface. The tool includes a power source connected to supply power to the rubbing surface. The rubbing surface is applied to the polyfilm wrapping while being moved to create an opening in the polyfilm wrapping caused at least in part by friction heat. The opening is created without damaging contents of the package.

Abstract: Methods and tools for opening polyfilm-wrapped packages. A tool includes a rubbing surface and a motor configured to move the rubbing surface. The tool includes a power source connected to supply power to the rubbing surface. The rubbing surface is applied to the polyfilm wrapping while being moved to create an opening in the polyfilm wrapping caused at least in part by friction heat. The opening is created without damaging contents of the package.

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A method for positioning a semiconductor die within a temporary package, including forming a representation of at least a portion of a semiconductor die, moving the semiconductor die to a location proximate a temporary package, and comparing the representation of the at least a portion of the semiconductor die to a representation of at least a portion of the temporary package. The compared representations are then used to define movement of a die moving assembly, in order to move the die to place the semiconductor die and the temporary package into a desired relationship to one another. A restraining device is then secured to the temporary package to retain the semiconductor die in the desired relationship to the temporary package.

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: An apparatus for automatically positioning electronic dice within temporary packages to enable continuity testing between the dice bond pads and the temporary package electrical interconnects is provided. The apparatus includes a robot having a programmable robot arm with a gripper assembly, die and lid feeder stations, a die inverter, and a plurality of cameras. The cameras take several pictures of the die and temporary packages to precisely align the die bond pads with the temporary package electrical interconnects. A predetermined assembly position is located along a conveyor that conveys a carrier between a first position, corresponding to an inlet, and a second position, corresponding to an outlet. The die, a restraining device and temporary package are assembled at the predetermined assembly position and tested for continuity therebetween. The apparatus further includes a fifth camera which locates the die at a wafer handler.

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

Abstract: A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of die to establish known good dice (KGD).