Abstract: An implantable electrode array is provided that includes a carrier that is flexible. At least one control module is coupled to the carrier. A shell encases the control module. At least one electrode is coupled to the carrier and is electrically connected to the control module.

Abstract: A method of manufacturing an electrode array is provided. The electrode array is configured to be applied against living tissue. The method comprises providing a flexible sheet that has a plurality of conductors. A plurality of integrated circuits are mounted to the flexible sheet so that the plurality of integrated circuits are bonded to the plurality of conductors. Electrodes are provided over the plurality of integrated circuits.

Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Abstract: An implantable electrode array is provided that includes a carrier that is flexible. At least one control module is coupled to the carrier. A shell encases the control module. At least one electrode is coupled to the carrier and is electrically connected to the control module.

Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.

Abstract: An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.

Abstract: An implantable electrode array (40, 310) that includes multiple spaced apart electrodes (42, 316) to which current can be individually sourced and sunk. The array includes a carrier (80, 312) that supports the electrodes. One or more control modules that source current to or sink current from the electrodes are disposed in windows (81, 404) within the carrier.

Abstract: A micro-machined accelerometer includes a moveable metal plate, mounted upon a semiconductor substrate. The moveable metal plate includes an aperture which contains a pedestal and at least one torsion bar for connecting the pedestal to the moveable metal plate. Measurement electrodes formed on the semiconductor substrate combine with the metal plate to form measurement capacitors A combined self-test/common electrode provides a dual function of a common electrode during operation of the accelerometer and a testing electrode during a self-test procedure.