Abstract: A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

Abstract: A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.

Abstract: A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

Abstract: A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.