Patents by Inventor Leng Nam Yin
Leng Nam Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7528007Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitate securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.Type: GrantFiled: April 25, 2006Date of Patent: May 5, 2009Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 7274095Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: June 8, 2004Date of Patent: September 25, 2007Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6864166Abstract: Aspects of the invention provide microelectronic device assemblies including microelectronic components wire bonded to substrates, and methods of forming such assemblies. In one embodiment of the invention, a microelectronic component includes a plurality of multi-layered bond pads. Each of the multi-layered bond pads includes a bond pad base (which may comprise aluminum), an outer bond layer (which may comprise gold), and an intermediate layer between the bond pad base and the outer bond layer. This microelectronic component may be wire bonded to a substrate, with the outer bond layer and the bonding wire both comprising the same metal (e.g., gold). The bonding wire may be reliably stitch bonded to the outer bond layer of the multi-layered bond pads, facilitating manufacture of low profile microelectronic device assemblies.Type: GrantFiled: September 29, 2003Date of Patent: March 8, 2005Assignee: Micron Technology, Inc.Inventors: Leng Nam Yin, Lim Thiam Chye
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Publication number: 20040217459Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: June 8, 2004Publication date: November 4, 2004Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6746894Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: GrantFiled: April 19, 2001Date of Patent: June 8, 2004Assignee: Micron Technology, Inc.Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng
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Patent number: 6650013Abstract: Aspects of the invention provide microelectronic device assemblies including microelectronic components wire bonded to substrates, and methods of forming such assemblies. In one embodiment of the invention, a microelectronic component includes a plurality of multi-layered bond pads. Each of the multi-layered bond pads includes a bond pad base (which may comprise aluminum), an outer bond layer (which may comprise gold), and an intermediate layer between the bond pad base and the outer bond layer. This microelectronic component may be wire bonded to a substrate, with the outer bond layer and the bonding wire both comprising the same metal (e.g., gold). The bonding wire may be reliably stitch bonded to the outer bond layer of the multi-layered bond pads, facilitating manufacture of low profile microelectronic device assemblies.Type: GrantFiled: August 30, 2001Date of Patent: November 18, 2003Assignee: Micron Technology, Inc.Inventors: Leng Nam Yin, Lim Thiam Chye
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Publication number: 20030049882Abstract: Aspects of the invention provide microelectronic device assemblies including microelectronic components wire bonded to substrates, and methods of forming such assemblies. In one embodiment of the invention, a microelectronic component includes a plurality of multi-layered bond pads. Each of the multi-layered bond pads includes a bond pad base (which may comprise aluminum), an outer bond layer (which may comprise gold), and an intermediate layer between the bond pad base and the outer bond layer. This microelectronic component may be wire bonded to a substrate, with the outer bond layer and the bonding wire both comprising the same metal (e.g., gold). The bonding wire may be reliably stitch bonded to the outer bond layer of the multi-layered bond pads, facilitating manufacture of low profile microelectronic device assemblies.Type: ApplicationFiled: August 30, 2001Publication date: March 13, 2003Inventors: Leng Nam Yin, Lim Thiam Chye
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Publication number: 20020142513Abstract: A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.Type: ApplicationFiled: April 19, 2001Publication date: October 3, 2002Inventors: Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay, Edmund Lua Koon Tian, Yap Kah Eng, Eric Tan Swee Seng