Abstract: A method for the electroplating of conductive metal onto a substrate containing at least one hole and an electroplateable surface which is conducive to subsequent metal deposition comprises placing the substrate in close proximity to an electrode but such that there is no substantial electrical continuity between the electroplateable surface and the electrode prior to electroplating. The electroplateable surface is preferably an electroplateable pattern which comprises either a conductive metal pattern or a catalytic pattern for subsequent plating. This process can be employed with any electroplateable pattern technique which is recognized in the art such as, for example, printing, stamping, plating, photographic or electrophotographic processes. In one embodiment, this process can be employed in the production of Plated Wire, i.e., a product which can be effectively employed as a replacement for drawn wires in power distribution applications.