Patents by Inventor Leon Resnicow

Leon Resnicow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4138656
    Abstract: An electrical component, comprising an insulating substrate having conductive material applied to one side thereof and including terminal pad portions for attaching electrically connecting leads thereto, in which said leads are provided with relatively thick rigid portions adapted to extend externally of the component to provide means for making electrical connections thereto and have relatively thinner, less rigid portions mechanically bonded to the other side of said substrate and have end portions dressed around the edge of said substrate to said one side thereof and electrically connected to said terminal pad portions by brazing, welding or soldering. In a preferred form, said leads may be bonded to said substrate by epoxy or other suitable cement and the end portions thereof may be made even thinner than the remainder of said thinner portions to facilitate dressing them around the edge of said substrate into contact with said terminal pad portions.
    Type: Grant
    Filed: November 15, 1976
    Date of Patent: February 6, 1979
    Assignee: Vishay Intertechnology, Inc.
    Inventor: Leon Resnicow