Abstract: Thermally assisted processes for removing internal defects in glass ceramic products, specifically electrical shorts formed in a substrate during product fabrication, are set forth. According to one aspect of the invention, a method for repairing shorts between metallic conductors located within in a glass ceramic product, such as an electronic substrate, comprises the steps of (a) pre-conditioning the glass to resist cracking from the generation of heat by any shorts melt down current subsequently applied to said conductors; and (b) subsequently applying a melt down current to said conductors to repair any short located therebetween. The aforestated method minimizes the potential for glass damage resulting from defect repair activity and optimizes defect repair yield.

Abstract: A micro dispense valve arrangement for accurately dispensing minute quantities of a fluid. The valve arrangement interfaces an enclosed interior region under pressure with an exterior region of less pressure through an orifice opening. The orifice wall is tapered from interior to exterior to bound a frustoconical region constricting toward the exterior to accommodate a magnetizable pellet or ball. The ball is held in its seated position against the orifice wall by permanent magnets imbedded in the wall. An AC coil surrounding the orifice opening acts when energized to cause the ball to move between its seated or closed position and a non-magnetizable screen in its open position. The frequency and duration of applied positive and negative pulses driving the coil act to control the on/off fluid flow duty cycle of the valve.