Patents by Inventor Leonard C. Pipes
Leonard C. Pipes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810980Abstract: Embodiments herein describe techniques for a transistor above a substrate. The transistor includes a channel layer above the substrate. The channel layer includes a first channel material of a first conductivity. In addition, the channel layer further includes elements of one or more additional materials distributed within the channel layer. The channel layer including the elements of the one or more additional materials has a second conductivity different from the first conductivity. Other embodiments may be described and/or claimed.Type: GrantFiled: June 28, 2019Date of Patent: November 7, 2023Assignee: Intel CorporationInventors: Chieh-Jen Ku, Pei-Hua Wang, Bernhard Sell, Martin M. Mitan, Leonard C. Pipes
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Patent number: 11784088Abstract: Embodiments disclosed herein include transistors and methods of forming such transistors. In an embodiment, the transistor may comprise a semiconductor channel with a first surface and a second surface opposite the first surface. In an embodiment, a source electrode may contact the first surface of the semiconductor channel and a drain electrode may contact the first surface of the semiconductor channel. In an embodiment, a gate dielectric may be over the second surface of the semiconductor channel and a gate electrode may be separated from the semiconductor channel by the gate dielectric. In an embodiment, an isolation trench may be adjacent to the semiconductor channel. In an embodiment, the isolation trench comprises a spacer lining the surface of the isolation trench, and an isolation fill material.Type: GrantFiled: January 29, 2019Date of Patent: October 10, 2023Assignee: Intel CorporationInventors: Chieh-Jen Ku, Bernhard Sell, Pei-Hua Wang, Harish Ganapathy, Leonard C. Pipes
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Publication number: 20220310601Abstract: Fin doping, and integrated circuit structures resulting therefrom, are described. In an example, an integrated circuit structure includes a semiconductor fin. A lower portion of the semiconductor fin includes a region having both N-type dopants and P-type dopants with a net excess of the P-type dopants of at least 2E18 atoms/cm3. A gate stack is over and conformal with an upper portion of the semiconductor fin. A first source or drain region is at a first side of the gate stack, and a second source or drain region is at a second side of the gate stack opposite the first side of the gate stack.Type: ApplicationFiled: March 24, 2021Publication date: September 29, 2022Inventors: Aaron D. LILAK, Cory WEBER, Stephen M. CEA, Leonard C. PIPES, Seahee HWANGBO, Rishabh MEHANDRU, Patrick KEYS, Jack YAUNG, Tzu-Min OU
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Publication number: 20220139913Abstract: Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric material, and the resulting assembly may be treated to form a dielectric layer around the structure.Type: ApplicationFiled: January 18, 2022Publication date: May 5, 2022Applicant: Intel CorporationInventors: Sang-Won Park, Dennis G. Hanken, Sishir Bhowmick, Leonard C. Pipes
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Patent number: 11270995Abstract: Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric material, and the resulting assembly may be treated to form a dielectric layer around the structure.Type: GrantFiled: March 5, 2017Date of Patent: March 8, 2022Assignee: Intel CorporationInventors: Sang-Won Park, Dennis G. Hanken, Sishir Bhowmick, Leonard C. Pipes
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Publication number: 20200411697Abstract: Embodiments herein describe techniques for a transistor above a substrate. The transistor includes a channel layer above the substrate. The channel layer includes a first channel material of a first conductivity. In addition, the channel layer further includes elements of one or more additional materials distributed within the channel layer. The channel layer including the elements of the one or more additional materials has a second conductivity different from the first conductivity. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 28, 2019Publication date: December 31, 2020Inventors: Chieh-Jen KU, Pei-Hua WANG, Bernhard SELL, Martin M. MITAN, Leonard C. PIPES
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Publication number: 20200243376Abstract: Embodiments disclosed herein include transistors and methods of forming such transistors. In an embodiment, the transistor may comprise a semiconductor channel with a first surface and a second surface opposite the first surface. In an embodiment, a source electrode may contact the first surface of the semiconductor channel and a drain electrode may contact the first surface of the semiconductor channel. In an embodiment, a gate dielectric may be over the second surface of the semiconductor channel and a gate electrode may be separated from the semiconductor channel by the gate dielectric. In an embodiment, an isolation trench may be adjacent to the semiconductor channel. In an embodiment, the isolation trench comprises a spacer lining the surface of the isolation trench, and an isolation fill material.Type: ApplicationFiled: January 29, 2019Publication date: July 30, 2020Inventors: Chieh-Jen KU, Bernhard SELL, Pei-Hua WANG, Harish GANAPATHY, Leonard C. PIPES
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Publication number: 20200126980Abstract: Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric material, and the resulting assembly may be treated to form a dielectric layer around the structure.Type: ApplicationFiled: March 5, 2017Publication date: April 23, 2020Applicant: Intel CorporationInventors: Sang-Won Park, Dennis G. Hanken, Sishir Bhowmick, Leonard C. Pipes
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Patent number: 7061068Abstract: Ions are implanted into the dielectric layer and/or barrier layer over a semiconductor substrate to change the polish rates of either or both layers during formation of a shallow trench isolation (STI) structure. The ion implantation can change or affect the polish rates of the material and the polish selectivity, and reduce or minimize unwanted topography resulting from chemical mechanical polishing (CMP). After CMP, the resulting STI structure has a more uniform and smooth topography.Type: GrantFiled: January 26, 2004Date of Patent: June 13, 2006Assignee: Intel CorporationInventors: Leonard C. Pipes, Rita Slilaty
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Publication number: 20040155341Abstract: Ions are implanted into the dielectric layer and/or barrier layer over a semiconductor substrate to change the polish rates of either or both layers during formation of a shallow trench isolation (STI) structure. The ion implantation can change or affect the polish rates of the material and the polish selectivity, and reduce or minimize unwanted topography resulting from chemical mechanical polishing (CMP). After CMP, the resulting STI structure has a more uniform and smooth topography.Type: ApplicationFiled: January 26, 2004Publication date: August 12, 2004Inventors: Leonard C. Pipes, Rita Slilaty
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Patent number: 6713385Abstract: Ions are implanted into the dielectric layer and/or barrier layer over a semiconductor substrate to change the polish rates of either or both layers during formation of a shallow trench isolation (STI) structure. The ion implantation can change or affect the polish rates of the material and the polish selectivity, and reduce or minimize unwanted topography resulting from chemical mechanical polishing (CMP). After CMP, the resulting STI structure has a more uniform and smooth topography.Type: GrantFiled: October 31, 2002Date of Patent: March 30, 2004Assignee: Intel CorporationInventors: Leonard C. Pipes, Rita Slilaty
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Patent number: 6590271Abstract: A shallow trench isolation (STI) structure is formed by etching trenches into the surface of a substrate in alignment with a patterned masking layer. An ion implantation of, for example, carbon, nitrogen, or oxygen, is performed so as to create an electrically insulating layer extending downwardly from a bottom surface of the trench. By implanting such extensions, STI structures with greater effective aspect ratios may be obtained which, in turn, allow greater packing density in integrated circuits. Implanted isolation structures may be formed without etching a trench by implanting into regions of the substrate. In this way, trench etch, dielectric back-fill, and planarization operations can be eliminated. Furthermore the implanted regions may be formed by multiple implants at different energies so as to obtain multiple, typically contiguous, target ranges.Type: GrantFiled: August 24, 2001Date of Patent: July 8, 2003Assignee: Intel CorporationInventors: Mark Y. Liu, Leonard C. Pipes, Mitchell C. Taylor
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Patent number: 6432798Abstract: A shallow trench isolation (STI) structure is formed by etching trenches into the surface of a substrate in alignment with a patterned masking layer. An ion implantation of, for example, carbon, nitrogen, or oxygen, is performed so as to create an electrically insulating layer extending downwardly from a bottom surface of the trench. By implanting such extensions, STI structures with greater effective aspect ratios may be obtained which, in turn, allow greater packing density in integrated circuits. Implanted isolation structures may be formed without etching a trench by implanting into regions of the substrate. In this way, trench etch, dielectric back-fill, and planarization operations can be eliminated. Furthermore the implanted regions may be formed by multiple implants at different energies so as to obtain multiple, typically contiguous, target ranges.Type: GrantFiled: August 10, 2000Date of Patent: August 13, 2002Assignee: Intel CorporationInventors: Mark Y. Liu, Leonard C. Pipes, Mitchell C. Taylor
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Publication number: 20020037627Abstract: A shallow trench isolation (STI) structure is formed by etching trenches into the surface of a substrate in alignment with a patterned masking layer. An ion implantation of, for example, carbon, nitrogen, or oxygen, is performed so as to create an electrically insulating layer extending downwardly from a bottom surface of the trench. By implanting such extensions, STI structures with greater effective aspect ratios may be obtained which, in turn, allow greater packing density in integrated circuits. Implanted isolation structures may be formed without etching a trench by implanting into regions of the substrate. In this way, trench etch, dielectric back-fill, and planarization operations can be eliminated. Furthermore the implanted regions may be formed by multiple implants at different energies so as to obtain multiple, typically contiguous, target ranges.Type: ApplicationFiled: August 24, 2001Publication date: March 28, 2002Inventors: Mark Y. Liu, Leonard C. Pipes, Mitchell C. Taylor