Abstract: A method and system of minimizing sticky keys in an electronic device having a body, circuitry, and a plurality of keypads is disclosed. The method and system comprise providing a protectant coating; and applying the protectant coating on surfaces of both the keypad and also the body to prevent sticking between the mating surfaces. A system and method is added in accordance with the present invention utilizing a protectant on critical surfaces which serves to prevent the residual buildup of contaminants following spills. In so doing the sticky key problem associated with the contaminated buildup is substantially eliminated.

Abstract: A method and system of minimizing sticky keys in an electronic device having a body, circuitry, and a plurality of keypads is disclosed. The method and system comprise providing a protectant coating; and applying the protectant coating on surfaces of both the keypad and also the body to prevent sticking between the mating surfaces. A system and method is added in accordance with the present invention utilizing a protectant on critical surfaces which serves to prevent the residual buildup of contaminants following spills. In so doing the sticky key problem associated with the contaminated buildup is substantially eliminated.

Abstract: A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.

Abstract: The top and bottom parts of a one-piece cover of a PCMCIA card are snapped together to form lap-joint seams which are welded together with a laser, under argon gas. Only a few small tack welds are required to substantially increases the mechanical strength and moisture resistance and to eliminate the risk of accidentally opening the card. The operation can be done at a high rate with minimal cost. Also, an internal frame may be made much narrower to allow more card area, while still meeting structural requirements for PCMCIA cards. The weld penetrates fully through the first layer of the seam and only partially through a second layer. During welding a fixture holds the seams in reasonably precise position and tightly closed so the seams are much tighter after welding than when the card is only snap closed. The precise positioning of the seams also allows the size of the weld to be minimized which reduces the risk of burn through which may damage electronic components enclosed within the card during welding.

Abstract: A cartridge having top and bottom metal covers which enclose a circuit board, the metal of the covers forming a seam which is welded at locations therealong to bond the two covers together. The covers may form a snap-fit, lap, or butting seam where the welds are applied. The cartridge is particularly useful in PCMCIA applications.

Abstract: The present invention features an improvement in the construction and manufacturing of small peripheral cartridges which plug into exterior slots of computer systems such as PCMCIA cards. The metal cover of a snap-together PCMCIA card is typically tack welded at its seams An inexpensive and highly accurate welding technique is presented for performing this welding operation. The inventive welding technique may be used without risk of damage to highly sensitive electronic components. The lap joint seam formed using the techniques exhibits the strength and stiffness characteristics that allow the size of welded seams to be minimized thereby also reducing the risk of burn-through or other damage to the cards during manufacturing.

Abstract: A latching connector assembly includes a mechanism which provides audible and tactile sensation indicating that the parts of the connector assembly are latched or unlatched (opened). The mechanism includes fixed obstructions or protrusions (molded-in detents) disposed on both sides of the latching shaft located in the fixed portion of the plug part of the connector assembly. Latching posts are provided on the movable portion (latch mechanism) of the plug part. The posts co-act with the protrusions, as the latching mechanism is moved forward or backward in the latch shaft, causing an audible sound and positive/tactile feel, when latching or unlatching the plug part to the receptacle part of the connector assembly.