Patents by Inventor Leonard E. Riggan, Jr.

Leonard E. Riggan, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6680021
    Abstract: A meltblowing method and system for dispensing first and second fluids from corresponding first and second orifices of a die assembly to form a meltblown first fluid filament. The die assembly directs the first and second fluid flows parallelly, or divergently, or directs two second fluid flows convergently toward a common first fluid flow, whereby the first and second fluids are dispensed from orifices at equal first fluid flow rates and equal second fluid flow rates. The die assembly is compressably retained between opposing end plates coupled to an adapter for further coupling to a main manifold having a fluid metering device for supplying first fluid to the die assembly. The meltblown filaments are depositing onto a moving substrate by vacillating the filament non-parallel to a direction of substrate movement, whereby vacillation a first fluid flow is controllable by an angle between the first fluid flow and one or more flanking second fluid flows, among other variables.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: January 20, 2004
    Assignee: Illinois Toolworks Inc.
    Inventors: Kui-Chiu Kwok, Edward W. Bolyard, Jr., Leonard E. Riggan, Jr.
  • Patent number: 5904298
    Abstract: A meltblowing method and system for dispensing first and second fluids from corresponding first and second orifices of a die assembly to form a meltblown first fluid filament. The die assembly directs the first and second fluid flows parallelly, or divergently, or directs two second fluid flows convergently toward a common first fluid flow, whereby the first and second fluids are dispensed from orifices at equal first fluid flow rates and equal second fluid flow rates. The die assembly is compressably retained between opposing end plates coupled to an adapter for further coupling to a main manifold having a fluid metering device for supplying first fluid to the die assembly. The meltblown filaments are depositing onto a moving substrate by vacillating the filament non-parallel to a direction of substrate movement, whereby vacillation a first fluid flow is controllable by an angle between the first fluid flow and one or more flanking second fluid flows, among other variables.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: May 18, 1999
    Assignee: Illinois Tool Works Inc.
    Inventors: Kui-Chiu Kwok, Edward W. Bolyard, Jr., Leonard E. Riggan, Jr.
  • Patent number: 5862986
    Abstract: A system usable for dispensing fluids including hot melt adhesives, supplied from a reservoir, onto a substrate. The system includes a plurality of fluid dispensing nozzles coupled to a fluid supply conduits disposed in a main manifold wherein fluid is supplied from a fluid metering device. An air preheater module is mountable to the nozzles and provides heated air for controlling the fluid dispensed by the nozzles. The main manifold includes a plurality of recirculation conduits each disposed between a fluid supply conduit and the fluid reservoir. A one-way valve disposed along each recirculation conduit conditionally recirculates fluid toward the fluid reservoir. A variety of recirculation manifold configurations are interchangeably mounted to the main manifold for recirculating fluid toward the fluid reservoir. Fluid pressure gauges monitor pressure in individual fluid supply conduits, or alternatively an average fluid pressure.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: January 26, 1999
    Assignee: Illinois Tool Works, Inc.
    Inventors: Edward W. Bolyard, Jr., Leonard E. Riggan, Jr.