Abstract: A shielded socket includes a conducting plate including a plurality of apertures, and an insulating layer. The insulating layer surrounds the conducting plate and lines at least one aperture. In an implementation, the conducting plate includes at least one grounding site.

Abstract: An improved stacking connector. The connector includes a plug portion and a receptacle portion. The plug portion includes a plug signal pin and a plug impedance control pin located adjacent to the plug signal pin. The receptacle portion includes a receptacle signal pin for engaging the plug signal pin when the plug portion and the receptacle portion are in a mated position. The connector also includes an impedance control shield which is located adjacent to the plug signal pin or receptacle signal pin.

Abstract: A shielded socket includes a conducting plate including a plurality of apertures, and an insulating layer. The insulating layer surrounds the conducting plate and lines at least one aperture. In an implementation, the conducting plate includes at least one grounding site.

Abstract: The present invention is a memory bus connector for accommodating a memory module that is parallel to a motherboard. The memory bus connector of the present invention has a plurality of individual contacts that act as data signal contacts and/or ground members that connect to the lower portion the parallel memory module. The memory bus connector of the present invention also has a sheet grounding member that connects to the upper portion of the memory module.

Abstract: A shielded socket includes a conducting plate including a plurality of apertures, and an insulating layer. The insulating layer surrounds the conducting plate and lines at least one aperture. In an implementation, the conducting plate includes at least one grounding site.

Abstract: The present invention is a memory bus connector for accommodating a memory module that is parallel to a motherboard. The memory bus connector of the present invention has a plurality of individual contacts that act as data signal contacts and/or ground members that connect to the lower portion the parallel memory module. The memory bus connector of the present invention also has a sheet grounding member that connects to the upper portion of the memory module.

Abstract: The present invention is a memory bus connector for accommodating a memory module that is parallel to a motherboard. The memory bus connector of the present invention has a plurality of individual contacts that act as data signal contacts and/or ground members that connect to the lower portion the parallel memory module. The memory bus connector of the present invention also has a sheet grounding member that connects to the upper portion of the memory module.

Abstract: An improved method and apparatus for transferring signals through a stacking connector. A disclosed apparatus includes a first engaging contact member mounted on a first circuit board and a second engaging contact member which removably engages the first engaging contact member mounted on a second circuit board. The first engaging contact member is electrically coupled to a first signal line on the first circuit board and the second engaging contact member is electrically coupled to a second signal line on the second circuit board. A conductive barrier partially surrounds the second engaging contact member. The barrier has at least one connector connecting the barrier to a bias voltage line.

Abstract: An apparatus for electrically connecting electrical contact pads on a first circuit board to electrical contact pads on a second circuit board is disclosed. Conductive bumps coupled to signal wires on a support element mate with the electrical contact pads on the first and second circuit boards. The mating provides an electrical connection allowing signals to be transmitted between the circuit boards. Alignment holes and alignment circuitry provide a means for verifying that the proper conductive bumps are mating with the proper electrical contact pads.

Abstract: A rigid enclosure for printed circuit boards that utilizes identical top and bottom covers and provides for offsetting the distance the printed circuit board sits from the bottom cover. The enclosure utilizes features formed into the covers to provide for alignment and fastening. Removable vents provide for air flow to cool the printed circuit board and when removed, allow access for interface to the printed circuit board. Threaded inserts and standoffs provide flexibility for fastening identical parts together.

Abstract: A connection system for use in connecting a high density flexible circuit directly to a surface mounted integrated circuit component mounted on a printed circuit board. The connection system utilizes an upper and lower stiffener plate to route the contacts of the high density flexible circuit to the pins of the integrated circuit component. The connection system utilizes silicone rubber pressure rods to create a force on the contacts of the higher density flexible circuit to ensure reliable connection to the leads of the surface mounted components. The connection system utilizes comb spacers which define slots to align the contacts of the high density circuit to the pins of the integrated circuit component and a top clamp to retain the assembly onto the integrated circuit component.

Abstract: A high density flexible circuit for coupling electrical devices. The flexible circuit has signal and ground traces on both sides of the flexible circuit. Each signal trace is surrounded by ground traces. There is a ground trace on either side of each signal trace and two ground traces located below each signal trace. This system of placing ground traces surrounding each signal trace reduces electrical noise between the signal traces and reduces the electrical capacitance of the circuit.