Abstract: Method and apparatus for providing nonvolatile storage with a programmable transistor. The method includes receiving a data value to be stored in the programmable transistor and programming the programmable transistor to store the received data value. Programming includes applying a selected voltage to the programmable transistor. The selected voltage is selected to inject carriers into a gate oxide layer of the programmable transistor. The carriers are maintained in the gate oxide layer of the programmable transistor in the absence of the selected voltage, thereby programming the programmable transistor with the received data value.

Abstract: Method and apparatus for providing nonvolatile storage with a programmable transistor. The method includes receiving a data value to be stored in the programmable transistor and programming the programmable transistor to store the received data value. Programming includes applying a selected voltage to the programmable transistor. The selected voltage is selected to inject carriers into a gate oxide layer of the programmable transistor. The carriers are maintained in the gate oxide layer of the programmable transistor in the absence of the selected voltage, thereby programming the programmable transistor with the received data value.

Abstract: A method of self-repair for a DRAM integrated circuit includes internally generating a bit pattern and writing the pattern to an array of memory cells within the integrated circuit. The DRAM integrated circuit reads from the array and internally compares the read data with the generated pattern to determine addresses for failed memory cells. The DRAM integrated circuit sets internal soft fuses that record the addresses of the failed memory cells and provide substitute memory cells for the failed memory cells from a redundant memory portion of the array. The self-repair process occurs each time the DRAM integrated circuit is powered up, thus permitting the integrated circuit to adapt to failures when installed in electronic devices and lessening the need for repair during manufacturing.

Abstract: A method of self-repair for a DRAM integrated circuit includes internally generating a bit pattern and writing the pattern to an array of memory cells within the integrated circuit. The DRAM integrated circuit reads from the array and internally compares the read data with the generated pattern to determine addresses for failed memory cells. The DRAM integrated circuit sets internal soft fuses that record the addresses of the failed memory cells and provide substitute memory cells for the failed memory cells from a redundant memory portion of the array. The self-repair process occurs each time the DRAM integrated circuit is powered up, thus permitting the integrated circuit to adapt to failures when installed in electronic devices and lessening the need for repair during manufacturing.

Abstract: A circuit and method of operation for combining commands in a DRAM (dynamic random access memory) are revealed. The method applies to DRAMs having a plurality of memory banks or arrays. The method combines commands to rows on different memory banks, and the method also combines row and column commands on different memory banks. The method eliminates steps in a sequence of commands, and may significantly increase speed of input/output to a DRAM.