Abstract: A heat sink for cooling a heated component, the heat sink comprising a base coupled to the component. In addition, the heat sink comprises at least one thin-walled heat transfer member extending from the base. The heat transfer member comprises an upstream end and a downstream end defined by a fluid flow direction, and a convective surface extending between the upstream end and the downstream end. Further, the convective surface includes a recessed oval dimple having a major axis and a minor axis. The oval dimple is oriented such that its major axis is at an angle ? relative to the fluid flow direction, wherein the angle ? is between 75° and less than 115°.

Abstract: A device and method for interstitially insulating a region. In an embodiment, the interstitial insulation comprises a material. In addition, the interstitial insulation comprises a layer mounted to the material. Further, the interstitial insulation comprises an interstice disposed between the material and the layer, wherein the interstice is sufficient to reduce heat transfer across the interstitial insulation.