Patents by Inventor Les Warren

Les Warren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion inhibitors, methods of production and uses thereof
    Patent number: 7686980
    Abstract: Compositions for actively inhibiting corrosion are described herein that include at least one active corrosion inhibitor compound, and at least one conventional corrosion inhibitor compound. In addition, methods for producing a composition that actively reduces corrosion are described herein and include providing at least one active corrosion inhibitor, providing at least one conventional corrosion inhibitor compound or corrosion protection compound, and blending the at least one active corrosion inhibitor and the at least one conventional corrosion inhibitor compound or corrosion protection compound to form the composition. In addition, a composition for actively inhibiting corrosion is described herein that includes at least one active corrosion inhibitor compound, wherein the at least one active corrosion inhibitor compound comprises a derivative or salt of a thio-, thia- or dithiocarbarnic acid, or a combination thereof and at least one conventional corrosion inhibitor compound.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: March 30, 2010
    Assignee: Teledyne Scientific & Imaging, LLC
    Inventors: Martin Kendig, Melitta Hon, Les Warren
  • Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method
    Patent number: 7538032
    Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: May 26, 2009
    Assignee: Teledyne Scientific & Imaging, LLC
    Inventors: Robert L. Borwick, Philip A. Stupar, Jeffrey F. DeNatale, Chailun Tsai, Zhimin J. Yao, Kathleen Garrett, John White, Les Warren, Morgan Tench
  • Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method
    Publication number: 20060292866
    Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Inventors: Robert Borwick, Philip Stupar, Jeffrey DeNatale, Chailun Tsai, Zhimin Yao, Kathleen Garrett, John White, Les Warren, Morgan Tench