Abstract: The connector comprises means (2) defining a bore (4) to receive a bared end portion or portions (20) of an optical fibre cable (16), the means (2) being surrounded by a body (12) of sealant material and a member (10) of heat recoverable material. After insertion of the cable or cables, (16) the member (12) is recovered and compresses the sealant material (10) into intimate contact with the means (2) and cable or cables (16).

Abstract: A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

Abstract: A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.

Abstract: A solder-containing polymeric terminator provides strain-relieved, insulated terminations between conductors and, especially, flat substrates. The terminator comprises two polymeric layers, the first of which has windows through which soldered electrical connections may be made, and the second of which is heat recoverable and attached to the first to form pockets to receive the conductors, and solder strips positioned between the layers and in proximity to the windows.

Abstract: Electrical connections to line substrates, such as cables, are made by employing a radially shrinkable coil member which is positioned about the substrate in an expanded form and is then caused or allowed to revert to a smaller radius so that it grips the substrate. In preferred embodiments the coil member is made from a heat-recoverable material or is made from a resilient material which is held in an expanded form by a disburdenable material, e.g. a fusible material such as solder, which is subsequently removed, deformed or destroyed so as to cause connection. The devices are especially suitable for connecting earth leads to the sheaths of mineral insulated cables in the vicinity of terminations and splices thereof.