Patents by Inventor Leslie Paul WALLIS
Leslie Paul WALLIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200279825Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.Type: ApplicationFiled: November 8, 2019Publication date: September 3, 2020Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Leslie Paul Wallis
-
Publication number: 20200259467Abstract: Radio frequency amplifiers with overload protection are provided herein. In certain configurations, an RF amplifier system includes an RF amplifier that receives an RF signal from an input terminal and that generates an amplified RF signal at an output terminal, and an overload detection circuit that generates a detection signal indicating a detected signal level of the RF amplifier. The RF amplifier includes an amplification device that amplifies the RF signal and a degeneration circuit that provides degeneration to the amplification device. Additionally, the detection signal is operable to control an amount of degeneration provided by the degeneration circuit so as to protect the RF amplifier from overload.Type: ApplicationFiled: November 13, 2019Publication date: August 13, 2020Inventor: Leslie Paul Wallis
-
Patent number: 10666205Abstract: Apparatus and methods for overload protection of low noise amplifiers (LNAs) are provided herein. In certain configurations, an LNA system includes a switch having an analog control input, an LNA configured to provide amplification to a radio frequency (RF) input signal received from the switch, a detector configured to generate a detection current based on detecting a signal level of the LNA, and an error amplifier configured to amplify the detection current to generate an overload protection signal that controls the analog control input.Type: GrantFiled: August 21, 2018Date of Patent: May 26, 2020Assignee: Skyworks Solutions, Inc.Inventor: Leslie Paul Wallis
-
Patent number: 10629553Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a power amplifier in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The power amplifier includes an injection-locked oscillator driver stage. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.Type: GrantFiled: March 15, 2019Date of Patent: April 21, 2020Assignee: Skyworks Solutions, Inc.Inventors: Yasser Khairat Soliman, Leslie Paul Wallis
-
Publication number: 20200058619Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.Type: ApplicationFiled: August 29, 2019Publication date: February 20, 2020Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis
-
Patent number: 10548223Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: GrantFiled: January 24, 2019Date of Patent: January 28, 2020Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
-
Patent number: 10515924Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.Type: GrantFiled: March 9, 2018Date of Patent: December 24, 2019Assignee: Skyworks Solutions, Inc.Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Leslie Paul Wallis
-
Patent number: 10511270Abstract: Radio frequency amplifiers with overload protection are provided herein. In certain configurations, an RF amplifier system includes an RF amplifier that receives an RF signal from an input terminal and that generates an amplified RF signal at an output terminal, and an overload detection circuit that generates a detection signal indicating a detected signal level of the RF amplifier. The RF amplifier includes an amplification device that amplifies the RF signal and a degeneration circuit that provides degeneration to the amplification device. Additionally, the detection signal is operable to control an amount of degeneration provided by the degeneration circuit so as to protect the RF amplifier from overload.Type: GrantFiled: March 30, 2018Date of Patent: December 17, 2019Assignee: Skyworks Solutions, Inc.Inventor: Leslie Paul Wallis
-
Publication number: 20190343000Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.Type: ApplicationFiled: June 10, 2019Publication date: November 7, 2019Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
-
Patent number: 10446524Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.Type: GrantFiled: July 27, 2018Date of Patent: October 15, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis
-
Patent number: 10404219Abstract: Front-end system having switchable amplifier output stage. In some embodiments, a method for operating a front-end system can include amplifying a signal in a driver stage of a power amplifier, and routing the signal from the driver stage to a selected one of a plurality of output stages, such that the selected output stage further amplifies the signal. The method can further include routing the amplified signal for transmission from the selected output stage to a selected one of a plurality of antennas.Type: GrantFiled: April 24, 2018Date of Patent: September 3, 2019Assignee: Skyworks Solutions, Inc.Inventor: Leslie Paul Wallis
-
Patent number: 10367536Abstract: A surface acoustic wave (SAW) filter that receives an aggregate circuit and outputs two or more sub-signals on outputs each of a different frequency band. The sub-signals are amplified by low noise amplifiers and, in one implementation, the amplified sub-signals can be summed. The outputs are connected via a switched passive network so that portions of the sub-signals on the outputs that are not in the selected frequency band are at least partially terminated.Type: GrantFiled: August 6, 2018Date of Patent: July 30, 2019Assignee: Skyworks Solutions, Inc.Inventor: Leslie Paul Wallis
-
Publication number: 20190230794Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
-
Patent number: 10362678Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.Type: GrantFiled: April 17, 2017Date of Patent: July 23, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio
-
Publication number: 20190214354Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a power amplifier in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The power amplifier includes an injection-locked oscillator driver stage. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.Type: ApplicationFiled: March 15, 2019Publication date: July 11, 2019Inventors: Yasser Khairat Soliman, Leslie Paul Wallis
-
Publication number: 20190181815Abstract: Aspects of this disclosure relate to an impedance transformation circuit and overload protection for a low noise amplifier. A low noise amplifier can include a first inductor, an amplification circuit configured to amplify a radio frequency signal, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. A switch can be coupled to the amplification circuit of the low noise amplifier. An overload protection circuit can adjust an impedance of the switch based on a signal level associated with the radio frequency signal to provide overload protection for the low noise amplifier.Type: ApplicationFiled: January 3, 2019Publication date: June 13, 2019Inventor: Leslie Paul Wallis
-
Publication number: 20190181809Abstract: Aspects of this disclosure relate to an impedance transformation circuit for use in an amplifier, such as a low noise amplifier. The impedance transformation circuit includes a matching circuit including a first inductor. The impedance transformation circuit also includes a second inductor. The first and second inductors are magnetically coupled to each other to provide negative feedback to linearize the amplifier.Type: ApplicationFiled: January 31, 2019Publication date: June 13, 2019Inventor: Leslie Paul Wallis
-
Patent number: 10276521Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.Type: GrantFiled: December 28, 2017Date of Patent: April 30, 2019Assignee: Skyworks Solutions, Inc.Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Yasser Khairat Soliman, Leslie Paul Wallis, René RodrÃguez
-
Patent number: 10230337Abstract: Aspects of this disclosure relate to an impedance transformation circuit for use in an amplifier, such as a low noise amplifier. The impedance transformation circuit includes a matching circuit including a first inductor. The impedance transformation circuit also includes a second inductor. The first and second inductors are magnetically coupled to each other to provide negative feedback to linearize the amplifier.Type: GrantFiled: October 19, 2017Date of Patent: March 12, 2019Assignee: Skyworks Solutions, Inc.Inventor: Leslie Paul Wallis
-
Patent number: 10231341Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.Type: GrantFiled: February 6, 2018Date of Patent: March 12, 2019Assignee: Skyworks Solutions, Inc.Inventors: Darren Roger Frenette, George Khoury, Leslie Paul Wallis, Lori Ann DeOrio