Abstract: A package for a semiconductor device includes a base having a flat surface with an edge of a predetermined shape for abutting against a similar edge of another object. Conductors are placed on the flat surface of the base and extend to but do not overlap the edge of predetermined shape. The base along with a frame and a cover cooperate to provide a package which encloses and protects the semiconductor device. The package can be placed adjacent a similarly shaped package so that the overall structure takes up a minimal amount of space. Ground planes located on the base can be readily interconnected.