Abstract: An apparatus and method for controlling local deposition rate in a physical vapor deposition process is provided. A magnet bar assembly is disposed inside a sputtering target. The magnet bar assembly comprises a magnet bar, a support member aligned with the magnet bar, and one or more sliding brackets that couple the support member to the magnet bar. Each sliding bracket compresses the magnet bar to the support member, allowing the use of spacers between the support member and the magnet bar to adjust local proximity of the magnet bar to the plasma bombarding the target.

Abstract: An apparatus and method for controlling local deposition rate in a physical vapor deposition process is provided. A magnet bar assembly is disposed inside a sputtering target. The magnet bar assembly comprises a magnet bar, a support member aligned with the magnet bar, and one or more sliding brackets that couple the support member to the magnet bar. Each sliding bracket compresses the magnet bar to the support member, allowing the use of spacers between the support member and the magnet bar to adjust local proximity of the magnet bar to the plasma bombarding the target.

Abstract: A circular groove formed in the end of a cylindrical target allows a retaining ring and flange ring to be attached to the target. The target can then be clamped to an endblock. Targets configured for screw-on affixation may be converted for clamped affixation in this way. Endblocks configured for screw-on targets are modified to clamp targets by modifying or replacing spindles and adding clamp rings.

Abstract: A side-entry specimen holder for transmission electron microscopy is provided. The specimen holder is capable of rotating a specimen and tilting it in two axes. The specimen, when mounted in the holder, can be tilted in the plus/minus direction of the X-axis, the plus/minus direction of the Y-axis, and simultaneously have the ability of 360° rotation in the axis of the electron beam to permit alignment of microstructural features of the specimen for optimal viewing and analysis.

Abstract: An apparatus and process for the etching and coating of samples in a single vacuum chamber, thus minimizing handling and transfer of the samples is provided. The apparatus includes a sealed chamber and a vacuum pump for forming and maintaining a vacuum in the chamber, a first ion gun positioned in the chamber to etch a sample, a sputtering target in the chamber, and at least one additional ion gun positioned in the chamber to cause material from the target to be directed onto the sample.