Patents by Inventor Lewis J. Rompala

Lewis J. Rompala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020157088
    Abstract: A system for and method of automating the execution of a data stream transformation project. The various embodiments described employ a trainable user interface translator application to record and manipulate data streams between a prospect's terminal emulation software and one or more prospect applications to be transformed. A remote user in communication with the prospect may observe prospect terminal screen displays, and optionally insert data, such as synchronization data into the recorded data streams. The user inserts the recorded data streams information into a targeted procedures model, which may be reviewed for approval by the prospect.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Applicant: Orchid Systems, Inc.
    Inventors: Lewis J. Rompala, David Wiegand, Neil Hickey
  • Publication number: 20020107970
    Abstract: A method of and apparatus for remotely preparing a targeted procedures model for transforming a data stream. The invention employs a telemodeler site communicatively connected to a prospect site and an Internet host. A telemodeler remotely prepares the targeted procedures model by executing steps including collecting prospect information, reviewing existing data streams, determining input and output parameters, designing transformed data streams, documenting the business process flow in the targeted procedures model, reviewing the model with the prospect, deciding whether the prospect approves the model, obtaining the prospect's approval, and providing a firm price and schedule.
    Type: Application
    Filed: February 7, 2001
    Publication date: August 8, 2002
    Inventors: David Wiegand, Lewis J. Rompala
  • Patent number: 4004044
    Abstract: A lift-off method for use in depositing thin films in the fabrication of integrated circuits which avoids edge tearing of the films. The method involves depositing an organic polymeric first masking material on a substrate, and forming on said material a layer of a polydimethylsiloxane resin material. The material, in turn, is covered by a second masking layer, preferably an organic polymeric resist material into which openings are placed in a selected pattern utilizing lithographic techniques. Then, conforming openings are placed in the underlying polydimethylsiloxane resin material and the openings are extended through the underlying resist material by successive reactive sputter etching steps to expose the substrate surface in the aforesaid selected pattern. The thin film to be deposited is then applied over the resulting structure; it is, thereby, deposited on the substrate in said openings.
    Type: Grant
    Filed: May 9, 1975
    Date of Patent: January 18, 1977
    Assignee: International Business Machines Corporation
    Inventors: Jack R. Franco, Janos Havas, Lewis J. Rompala