Abstract: A drag reduction assembly is mountable on a vehicle or other object experiencing relative motion in a fluid environment. The assembly comprises at least one shell of flexible web material movable between non-deployed and deployed positions. In addition, the shell is configured to provide at least an outer flow surface in the deployed position (e.g., a curved surface) to reduce the effects of aerodynamic drag. In many embodiments, intake apertures such as NACA ducts may be provided to allow a portion of the flowing fluid into the shell. The flowing fluid will cause the shell to assume automatically the deployed position. In cases where fluid enters the shell, an exit location is provided in the shell to permit such fluid to exit and rejoin fluid on the outside.

Abstract: A drag reduction assembly is mountable on a vehicle or other object experiencing relative motion in a fluid environment. The assembly comprises at least one shell of flexible web material movable between non-deployed and deployed positions. In addition, the shell is configured to provide at least an outer flow surface in the deployed position (e.g., a curved surface) to reduce the effects of aerodynamic drag. In many embodiments, intake apertures such as NACA ducts may be provided to allow a portion of the flowing fluid into the shell. The flowing fluid will cause the shell to assume automatically the deployed position. In cases where fluid enters the shell, an exit location is provided in the shell to permit such fluid to exit and rejoin fluid on the outside.

Abstract: A drag reduction assembly is mountable on a vehicle or other object experiencing relative motion in a fluid environment. The assembly comprises at least one shell of flexible web material movable between non-deployed and deployed positions. In addition, the shell is configured to provide at least an outer flow surface in the deployed position (e.g., a curved surface) to reduce the effects of aerodynamic drag. In many embodiments, intake apertures such as NACA ducts may be provided to allow a portion of the flowing fluid into the shell. The flowing fluid will cause the shell to assume automatically the deployed position. In cases where fluid enters the shell, an exit location is provided in the shell to permit such fluid to exit and rejoin fluid on the outside.

Abstract: An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant fluid between the evaporator head and components of a refrigeration system. The mechanical isolation assembly is configured to compensate for variations in the planar orientation of the device under test. Moreover, the mechanical isolation assembly preferably includes bellows through which the refrigerant fluid is conducted.

Abstract: An apparatus for controlling the temperature of an electronic device under test includes a thermal head. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the thermal head. A refrigeration system is connected in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto. An inlet valve and outlet valve are provided to facilitate disconnection of the thermal head from the refrigeration system. The valves are sequentially closed with the refrigeration system continuing to operate during the interim period so as to reclaim the refrigerant fluid. Accordingly, thermal head may be disconnected from refrigeration system and removed.

Abstract: An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar spring defined by slots in the base structure. The base structure has a manifold configured to route refrigerant fluid between the thermal head and components of a refrigeration system. The isolation arrangement is normally planar but is movable to facilitate engagement of the thermal head with the electronic device. The isolation arrangement also compensates for variations in the planar orientation of the electronic device.

Abstract: An apparatus for controlling the temperature of an electronic device under test includes a thermal head. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the thermal head. A refrigeration system is connected in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto. An inlet valve and outlet valve are provided to facilitate disconnection of the thermal head from the refrigeration system. The valves are sequentially closed with the refrigeration system continuing to operate during the interim period so as to reclaim the refrigerant fluid. Accordingly, thermal head may be disconnected from refrigeration system and removed.

Abstract: An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.

Abstract: An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will begin thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.

Abstract: A mesh storage apparatus comprises a conformal mesh member (14), which is attached to a retraction mechanism (10). Because the mesh member (14) has a point of attachment (20), rather than multiple points spread along one of its sides, the force of the retraction mechanism or another applied force collapses the mesh member along its major diagonal (13) into an elongated form, similar to that of a cable, rope, or strap, allowing for easy storage. It, therefore, takes advantage of the contractility of the mesh openings and the behavioral characteristics of conformal material under tension to store the mesh member (14) in a much more compact manner than with traditional storage apparatus.