Abstract: A multi-axis GMR or TGMR based magnetic field sensor system is disclosed. Preferably a three axis sensor system is provided for sensing magnetic flux along three mutually orthogonal axes, which can be used for magnetic compass or other magnetic field sensing applications. The sensing units are operative to sense X and Y axis magnetic flux signals in the device (XY) plane, while Z axis sensitivity is achieved by use of a continuous ring shaped or octagonal magnetic concentrator that is adapted to convert the Z axis magnetic flux signal into magnetic flux signals in the XY plane.

Abstract: A foldable substrate is provided that includes a first substrate portion with a first upper surface and a second substrate portion with a second upper surface. A foldable bridge portion couples the first substrate portion to the second substrate portion. The foldable bridge portion includes a coupling strip that extends from the first substrate portion to the second substrate portion with a gap corresponding to a portion of the coupling strip where the gap is defined between the first and second substrate portions by removing portions of a starting wafer substrate. The first and second portions, in one embodiment, include magnetic field sensors and the foldable bridge portion can be bent to arrange the two portions at a predetermined angle to one another. Once bent, the sensor package can be incorporated into a magnetic field sensor assembly to be integrated with other control circuitry.

Abstract: A monolithic tri-axis anisotropic magnetoresistive (AMR) sensor and the method of manufacturing of the AMR sensor are presented. In one embodiment, the monolithic tri-axis AMR sensor includes (a) a substrate, (b) a first horizontal direction sensor disposed on the substrate, (c) a second horizontal direction sensor disposed on the substrate, (d) a third horizontal direction sensor disposed on the substrate, and (e) a flux concentrator disposed on the third horizontal direction sensor, wherein the flux concentrator is in cooperation with the third horizontal direction sensor to realize a function of a Z-axis sensor, such that the Z-axis direction can be effectively measured. The integration of the tri-axis AMR sensor is therefore accomplished. In addition, the integrated tri-axis AMR sensor has low production cost and improved reliability.

Abstract: A Z-axis capacitive accelerometer includes a substrate, a capacitance sensing plate, a proof mass and at least one pair of spring beams. The capacitance sensing plate includes two symmetrical sense areas to create differential capacitive measurement. A decoupling structure separates the proof mass and the capacitance sensing plate and their rotational motions from each other. In the proposed Z axis capacitive accelerometer, the distance of the capacitance sensing plate relative to its rotation axis is considerably increased, thereby effectively enhancing the sensitivity when measuring the Z-axis acceleration.

Abstract: Micro-machined capacitive sensors implemented in micro-electro-mechanical system (MEMS) processes that have higher sensitivity, while providing an increased linear capacitive sensing range. Capacitive sensing is achieved via variable-area sensing, which employs a transduction mechanism in which the relationship between changes in the capacitance of variable, parallel-plate capacitors and displacements of a proof mass is generally linear. Each respective variable, parallel-plate capacitor is formed by a finger/electrode pair, in which both the finger and the electrode have rectangular tooth profiles that include a plurality of rectangular teeth.

Abstract: Single chip 3-axis thermal accelerometer devices include a substrate, at least one cavity etched in the substrate, a fluid disposed in the cavity, a bridge structure suspended over an opening of the cavity, and a plurality of heater elements and temperature sensing elements disposed on the bridge structure. The substrate has a substantially planar surface defined by X and Y coordinate axes, and the bridge structure is suspended over the opening of the cavity in the X-Y plane. In one embodiment, the bridge structure is configured to position at least two of the temperature sensing elements out of the X-Y plane. The heater and temperature sensing elements are disposed on the bridge structure in optimized arrangements for providing reduced temperature coefficients and for producing output voltages having reduced DC offset and drift.

Abstract: Single chip 3-axis thermal accelerometer devices include a substrate, at least one cavity etched in the substrate, a fluid disposed in the cavity, a bridge structure suspended over an opening of the cavity, and a plurality of heater elements and temperature sensing elements disposed on the bridge structure. The substrate has a substantially planar surface defined by X and Y coordinate axes, and the bridge structure is suspended over the opening of the cavity in the X-Y plane. In one embodiment, the bridge structure is configured to position at least two of the temperature sensing elements out of the X-Y plane. The heater and temperature sensing elements are disposed on the bridge structure in optimized arrangements for providing reduced temperature coefficients and for producing output voltages having reduced DC offset and drift.