Patents by Inventor Li Ann Wetz

Li Ann Wetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7108755
    Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: September 19, 2006
    Assignee: Motorola, Inc.
    Inventors: Li Ann Wetz, Lizabeth Ann Keser, Rajiv Bajaj, Treliant Fang
  • Patent number: 6796482
    Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: September 28, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Li Ann Wetz, Treliant Fang
  • Publication number: 20040084510
    Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Applicant: Motorola Inc.
    Inventors: Li Ann Wetz, Treliant Fang
  • Publication number: 20040020562
    Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.
    Type: Application
    Filed: July 30, 2002
    Publication date: February 5, 2004
    Applicant: Motorola Inc.
    Inventors: Li Ann Wetz, Lizabeth Ann Keser, Rajiv Bajaj, Treliant Fang