Abstract: A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate. The chip structure has an inclined sidewall, the inclined sidewall is at an acute angle to a vertical, the vertical is a direction perpendicular to a main surface of the chip structure, and the acute angle is in a range from about 12 degrees to about 45 degrees. The method also includes forming a protective layer to surround the chip structure.

Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.

Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.

Abstract: A client-side dynamic multi-routing power distribution system of an optical terminal equipment integrates the Power over Ethernet, dynamic multi-routing power distribution and power management technologies to dispatch power to the optical terminal equipment from a home gateway to meet power demands of the off-premise optical terminal equipment and to greatly reduce the cost for laying power lines for the off-premise FTTx optical terminal equipment, thereby expanding the coverage of optical fiber broadband service. The client-side dynamic multi-routing power distribution system includes (1) a network signal processing and DC power supply module of the home gateway for dispatching power to the remote FTTx optical terminal equipment through a telecom line at a network interface; (2) a network signal processing and DC powered module of the FTTx optical terminal equipment for handling multi-routing power distribution and dynamic load balancing from a plurality of home gateways.

Abstract: A client-side dynamic multi-routing power distribution system of an optical terminal equipment integrates the Power over Ethernet, dynamic multi-routing power distribution and power management technologies to dispatch power to the optical terminal equipment from a home gateway to meet power demands of the off-premise optical terminal equipment and to greatly reduce the cost for laying power lines for the off-premise FTTx optical terminal equipment, thereby expanding the coverage of optical fiber broadband service. The client-side dynamic multi-routing power distribution system includes (1) a network signal processing and DC power supply module of the home gateway for dispatching power to the remote FTTx optical terminal equipment through a telecom line at a network interface; (2) a network signal processing and DC powered module of the FTTx optical terminal equipment for handling multi-routing power distribution and dynamic load balancing from a plurality of home gateways.