Patents by Inventor Li-Chung Lee
Li-Chung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982944Abstract: A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.Type: GrantFiled: May 31, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsiao-Lun Chang, Chueh-Chi Kuo, Tsung-Yen Lee, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng, Che-Chang Hsu
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Patent number: 11973129Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device includes forming nanowire structures stacked over a substrate and spaced apart from one another, and forming a dielectric material surrounding the nanowire structures. The dielectric material has a first nitrogen concentration. The method also includes treating the dielectric material to form a treated portion. The treated portion of the dielectric material has a second nitrogen concentration that is greater than the first nitrogen concentration. The method also includes removing the treating portion of the dielectric material, thereby remaining an untreated portion of the dielectric material as inner spacer layers; and forming the gate stack surrounding nanowire structures and between the inner spacer layers.Type: GrantFiled: March 13, 2023Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Han-Yu Lin, Chansyun David Yang, Fang-Wei Lee, Tze-Chung Lin, Li-Te Lin, Pinyen Lin
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Publication number: 20240114523Abstract: A method for handling a multi-cell scheduling and a user equipment is provided. In the method, downlink control information (DCI) from a first serving cell is received. A first number of multiple scheduled cells according to the DCI is determined. The DCI is configured to schedule at least one communication on the scheduled cells. Th communication is performed on at least one of the first number of the scheduled cells according to the DCI. The DCI includes at least one single DCI field, at least one separate DCI field and at least one configurable DCI field.Type: ApplicationFiled: September 19, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Chien-Min Lee, Li-Chung Lo
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Patent number: 11950282Abstract: A device for handling channel access procedure includes a storage device and a processing circuit coupled to the storage device and configured to execute instructions stored in the storage device. The storage device is configured for storing the instructions of receiving an indication for an uplink transmission; determining at least one parameter of the device for a listen-before-talk procedure according to a capability of the device or a signaling from a base station; and performing the uplink transmission according to the indication.Type: GrantFiled: May 30, 2022Date of Patent: April 2, 2024Assignee: ACER INCORPORATEDInventors: Li-Chung Lo, Chien-Min Lee
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Patent number: 11950283Abstract: A device for handling channel access procedure includes a storage device and a processing circuit coupled to the storage device and configured to execute instructions stored in the storage device. The storage device is configured for storing the instructions of receiving an indication for an uplink transmission; determining at least one parameter of the device for a listen-before-talk procedure according to a capability of the device or a signaling from a base station; and performing the uplink transmission according to the indication.Type: GrantFiled: May 30, 2022Date of Patent: April 2, 2024Assignee: ACER INCORPORATEDInventors: Li-Chung Lo, Chien-Min Lee
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Patent number: 11950112Abstract: A UE for beam failure detection is provided. The RF signal processing device of the UE assesses a first radio link quality according to a first BFD-reference signal (BFD-RS) set including at least one reference signal, communicating with a plurality of transmission/reception points (TRPs) which include at least a first TRP and a second TRP. The processor of the UE is coupled to the RF signal processing device. When the first radio link quality is below a threshold, the processor generates a first indication, wherein the first indication is a first beam failure instance (BFI) or the first BFD-RS set. The processor enables a first timer and a first counter according to the first indication.Type: GrantFiled: July 12, 2021Date of Patent: April 2, 2024Assignee: ACER INCORPORATEDInventors: Li-Chung Lo, Chien-Min Lee
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Publication number: 20240097011Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITEDInventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
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Patent number: 11930550Abstract: A UE for beam failure detection is provided. The UE includes a radio frequency (RF) signal processing device. The RF signal processing device receives a first candidate-beam reference-signal (RS) list and a second candidate-beam RS list and reports a beam failure information. The first candidate-beam RS list is associated with a first beam-failure-detection RS (BFD-RS) set and the second candidate-beam RS list is associated with a second BFD-RS set. The beam failure information includes at least one of following: at least on component carrier (CC) index, at least one new candidate beam, an identity of BFD-RS set, or an CORESETPoolIndex.Type: GrantFiled: July 9, 2021Date of Patent: March 12, 2024Assignee: ACER INCORPORATEDInventors: Li-Chung Lo, Chien-Min Lee
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Publication number: 20140315489Abstract: A method and apparatus for performing wireless display sharing and an associated computer program product are provided, where the method is applied to an electronic device. The method includes the steps of: performing device detection by using a proximity sensing module of the electronic device to associate the electronic device with another electronic device to form a group, wherein the group may include a plurality of electronic devices such as the electronic device and the other electronic device; providing a user of the electronic device with a user interface to allow the user to select a specific digital data display arrangement type of a plurality of digital data display arrangement types for the electronic device; and obtaining data corresponding to the specific digital data display arrangement type and utilizing a display module of the electronic device to display the data.Type: ApplicationFiled: April 22, 2013Publication date: October 23, 2014Applicant: HTC CorporationInventor: Li-Chung Lee
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Apparatus for burnishing small asperities and cleaning loose particles from magnetic recording media
Patent number: 7164557Abstract: An air bearing burnish slider burnishes very small asperities and cleans the loose particles that adhere to the magnetic recording media. The slider applies a controllable contact force to effectively burnish disk asperities or partially attached particles. In addition, the slider cleans the loose particles effectively while flying in a stable fashion. In a low pitch design, diagonal rails push particles away from the disk surface and trailing edge pads contact the disk at lower linear velocities. Rail pads retain loose contamination and debris in their pockets and burnish asperities. Another design provides a milder burnish force and flies in a high pitch configuration. The trailing edge pads provide stable contacts and the rails help in sweeping away debris. In both designs, the contact forces can be controlled by adjusting linear velocities. A step taper at the leading edge provides a pitch-producing lift force.Type: GrantFiled: February 23, 2004Date of Patent: January 16, 2007Assignee: Hitachi Global Storage Technologies Netherlands BVInventors: Parul Agrawal, Hang Fai Ngo, Charles Lee, Li-Chung Lee, Ullal Vasant Nayak, Stephen Olson, Robert N. Payne, Christopher Ramm -
Publication number: 20050185343Abstract: An air bearing burnish slider burnishes very small asperities and cleans the loose particles that adhere to the magnetic recording media. The slider applies a controllable contact force to effectively burnish disk asperities or partially attached particles. In addition, the slider cleans the loose particles effectively while flying in a stable fashion. In a low pitch design, diagonal rails push particles away from the disk surface and trailing edge pads contact the disk at lower linear velocities. Rail pads retain loose contamination and debris in their pockets and burnish asperities. Another design provides a milder burnish force and flies in a high pitch configuration. The trailing edge pads provide stable contacts and the rails help in sweeping away debris. In both designs, the contact forces can be controlled by adjusting linear velocities. A step taper at the leading edge provides a pitch-producing lift force.Type: ApplicationFiled: February 23, 2004Publication date: August 25, 2005Inventors: Parul Agrawal, Hang Ngo, Charles Lee, Li-Chung Lee, Ullal Nayak, Stephen Olson, Robert Payne, Christopher Ramm
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Patent number: 6379570Abstract: A method is provided for making a well-defined, highly-predictable chevron type MR sensor for a read head. A first material is selected for a first gap layer. A selected second material is deposited on the first gap layer followed by a resist frame that has elongated openings exposing elongated top portions of the first gap layer that extend at an acute angle to a head surface of the read head. A selected reactive ion etch (RIE) is employed to etch away the exposed portions of the second material layer down to the first material of the first gap layer. The material of the second material layer is chosen to be etched by the RIE while the material of the first gap layer is chosen not to be etched by the RIE. An example is Al2O3 for the first gap layer, SiO2 for the second material layer and a RIE that is fluorine based. The resist frame is removed leaving elongated strips of the second material layer extending at the aforementioned angle to the head surface.Type: GrantFiled: November 29, 1999Date of Patent: April 30, 2002Assignee: International Business Machines CorporationInventors: Joseph John Fatula, Jr., Richard Hsiao, Carol Yoshiko Inouye, Li-Chung Lee
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Patent number: 6338361Abstract: The present invention provides a flow-control apparatus with a check function for controlling the flow resistance of a photoresist solution. The apparatus is connected to a photoresist supply device, the photoresist supply device comprising a tank for storing the photoresist solution, a pipe partially submerged in the photoresist solution in the tank to transport the photoresist solution, and a pump for drawing the photoresist solution from the tank. The apparatus comprises a housing and a sphere. The housing comprises a chamber, a top opening positioned at the top of the chamber, and a bottom opening positioned at the bottom of the chamber, wherein the top opening can be mated to an end of the pipe or to a bottom opening of another apparatus. The sphere is moveably set inside the chamber of the housing and increases the flow resistance of the photoresist solution.Type: GrantFiled: February 4, 2000Date of Patent: January 15, 2002Assignee: United Microelectronics Corp.Inventors: Chung-Hsien Kao, Ying-Ming Cheng, Li-Chung Lee, Chia-Wen Cheng
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Publication number: 20010042565Abstract: The present invention provides a flow-control apparatus with a check function for controlling the flow resistance of a photoresist solution. The apparatus is connected to a photoresist supply device, the photoresist supply device comprising a tank for storing the photoresist solution, a pipe partially submerged in the photoresist solution in the tank to transport the photoresist solution, and a pump for drawing the photoresist solution from the tank. The apparatus comprises a housing and a sphere. The housing comprises a chamber, a top opening positioned at the top of the chamber, and a bottom opening positioned at the bottom of the chamber, wherein the top opening can be mated to an end of the pipe or to a bottom opening of another apparatus. The sphere is moveably set inside the chamber of the housing and increases the flow resistance of the photoresist solution.Type: ApplicationFiled: February 4, 2000Publication date: November 22, 2001Applicant: WINSTON HSUInventors: Chung-Hsien Kao, Ying-Ming Cheng, Li-Chung Lee, Chia-Wen Cheng
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Patent number: 6176770Abstract: A grindstone having a vacuum system is applied to a pin chuck stepper. The vacuum system has a vacuum tube attached on the edge of the grindstone. When the grindstone moves on a pin chuck stage on the pin chuck stepper, the vacuum tube vacuums the pin chuck stage to free particles on the pin chuck stage.Type: GrantFiled: January 31, 2000Date of Patent: January 23, 2001Assignee: United Microelectronics Corp.Inventors: Chung-Hsien Kao, Patrick Cheng, Li-Chung Lee, Mei-Ling Chen
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Patent number: 6131271Abstract: A method planarizes a first pole piece layer of a write head by lapping without delaminating the first pole piece layer from an underlying second read gap layer on a wafer substrate. This is accomplished by separating or dicing the first pole piece material layer in a field region about rows and columns of first pole piece layers of magnetic head assemblies so as to reduce the stress of the first pole piece material layer in the field. Accordingly, when the wafer substrate is lapped, such as by chemical mechanical polishing (CMP), a reduced stress prevents the first pole piece material layer from delaminating from the second read gap layer during the lapping operation.Type: GrantFiled: June 25, 1999Date of Patent: October 17, 2000Assignee: International Business Machines CorporationInventors: Robert Edward Fontana, Jr., Hung-Chin Guthrie, William Leslie Guthrie, Eric James Lee, Li-Chung Lee, Francisco Agustin Martin
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Patent number: 6125644Abstract: A container of coolant used in a NIKON.TM. stepper is utilizing a screw cap to air-tightly close a coolant inlet of the container of coolant. The container of coolant is a closed system except the coolant inlet, a circulative input duct and a circulative output duct.Type: GrantFiled: May 8, 1998Date of Patent: October 3, 2000Assignee: United Microelectronics, Corp.Inventors: Shih-Hsun Chiu, Li-Chung Lee, Wei-Sheng Chia, Patrick Cheng
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Patent number: 6118623Abstract: A method is provided for making a well-defined, highly-predictable chevron type MR sensor for a read head. A first material is selected for a first gap layer. A selected second material is deposited on the first gap layer followed by a resist frame that has elongated openings exposing elongated top portions of the first gap layer that extend at an acute angle to a head surface of the read head. A selected reactive ion etch (RIE) is employed to etch away the exposed portions of the second material layer down to the first material of the first gap layer. The material of the second material layer is chosen to be etched by the RIE while the material of the first gap layer is chosen not to be etched by the RIE. An example is Al.sub.2 O.sub.3 for the first gap layer, SiO.sub.2 for the second material layer and a RIE that is fluorine based. The resist frame is removed leaving elongated strips of the second material layer extending at the aforementioned angle to the head surface.Type: GrantFiled: September 5, 1997Date of Patent: September 12, 2000Assignee: International Business Machines CorporationInventors: Joseph John Fatula, Jr., Richard Hsiao, Carol Yoshiko Inouye, Li-Chung Lee
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Patent number: 6021669Abstract: A container of coolant used in a NIKON.TM. stepper is utilizing a transparent duct mounted on a side of the container of coolant to check a liquid level. The container of coolant can be conventional or other similar container of coolant.Type: GrantFiled: May 7, 1998Date of Patent: February 8, 2000Assignee: United Microelectronics Corp.Inventors: Shih-Hsun Chiu, Li-Chung Lee, Wei-Sheng Chia, Patrick Cheng
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Patent number: 5251806Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.Type: GrantFiled: April 16, 1992Date of Patent: October 12, 1993Assignee: International Business Machines CorporationInventors: Birendra N. Agarwala, Aziz M. Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee, Karl J. Puttlitz, Sudipta K. Ray, James G. Ryan, Joseph G. Schaefer, Kamalesh K. Srivastava, Paul A. Totta, Erick G. Walton, Adolf E. Wirsing