Patents by Inventor Li-De HSIEH

Li-De HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic sensing device
    Patent number: 11035939
    Abstract: The disclosure discloses an ultrasonic sensing device, including a first shell portion, a second shell portion and an ultrasonic sensor. The first shell portion has a first through hole. The first through hole includes a first opening and a second opening. The second shell portion has a second through hole. The second through hole includes a third opening and a fourth opening. The ultrasonic sensor includes a transmitting unit and a receiving unit. The transmitting unit is coupled to the first opening. The receiving unit is coupled to the third opening. At least one of the second opening and the fourth opening is elongated. The ultrasonic sensing device greatly reduces the direct transmission of ultrasonic wave from the transmitting unit to the receiving unit.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: June 15, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Han Wu, Li-De Hsieh
  • ULTRASONIC SENSING DEVICE
    Publication number: 20200072954
    Abstract: The disclosure discloses an ultrasonic sensing device, including a first shell portion, a second shell portion and an ultrasonic sensor. The first shell portion has a first through hole. The first through hole includes a first opening and a second opening. The second shell portion has a second through hole. The second through hole includes a third opening and a fourth opening. The ultrasonic sensor includes a transmitting unit and a receiving unit. The transmitting unit is coupled to the first opening. The receiving unit is coupled to the third opening. At least one of the second opening and the fourth opening is elongated. The ultrasonic sensing device greatly reduces the direct transmission of ultrasonic wave from the transmitting unit to the receiving unit.
    Type: Application
    Filed: July 16, 2019
    Publication date: March 5, 2020
    Inventors: Hsin-Han WU, Li-De HSIEH