Patents by Inventor Li Fu
Li Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11928460Abstract: Embodiments of the present disclosure relate to a method, system, and computer program product for dynamic update of a computer program in memory. According to the method, one or more processors obtain incremental information, the incremental information specifying an incremental update to at least one section of at least one target function in a computer program. One or more processors identify, based on the incremental information, the at least one target function to be updated from the computer program. One or more processors generate at least one updated copy of the at least one target function by updating the at least one section of the at least one target function based on the incremental information. One or more processors update the computer program based on the at least one updated copy of the at least one target function while the computer program is running.Type: GrantFiled: April 20, 2022Date of Patent: March 12, 2024Assignee: International Business Machines CorporationInventors: Jin Hong Fu, Bao Zhang, Shi Chong Ma, He Huang, Naijie Li, Jia Yu
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Patent number: 11929547Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.Type: GrantFiled: April 7, 2023Date of Patent: March 12, 2024Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
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Patent number: 11926499Abstract: A folding device is provided. The folding device includes a bearing and fixing mechanism (1) configured to bear and fix a main body portion (21) of a to-be-folded device (2); a folding mechanism (3) located on at least one side of the bearing and fixing mechanism (1), the folding mechanism (3) being rotatably connected to the bearing and fixing mechanism (1) and configured to bear and fix a to-be-folded portion (22) of the to-be-folded device (2); and a driving mechanism (4) connected to the folding mechanism (3), the driving mechanism (4) being configured to drive the folding mechanism (3) to turn relative to the bearing and fixing mechanism (1), so as to fold the to-be-folded portion (22) to a side in a thickness direction of the main body portion (21). The folding device can fold automatically, and manual folding is avoided.Type: GrantFiled: April 9, 2021Date of Patent: March 12, 2024Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Shuqi Liu, Xinhong Lu, Wenyue Fu, Haoran Gao, Guangcai Yuan, Li Li, Shaodong Sun, Song Fang, Dongfeng Du, Qi Qi
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Patent number: 11929363Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.Type: GrantFiled: March 21, 2022Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Po-Lin Peng, Li-Wei Chu, Ming-Fu Tsai, Jam-Wem Lee, Yu-Ti Su
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Publication number: 20240079399Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
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Patent number: 11923259Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.Type: GrantFiled: November 11, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pu Wang, Li-Hui Cheng, Szu-Wei Lu, Tsung-Fu Tsai
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Patent number: 11913184Abstract: A snow thrower includes a motor, an auger driven by the motor to rotate, a handle device for a user to operate, an auger housing for containing the auger and a frame for connecting the handle device and the auger housing. The auger housing is made of at least two different materials.Type: GrantFiled: April 27, 2021Date of Patent: February 27, 2024Assignee: Chervon (HK) LimitedInventors: Xiangqing Fu, Feng Yuan, Keqiong Zhong, Qian Liu, Li Li, Toshinari Yamaoka, Fangjie Nie, Liang Chen
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Publication number: 20230380609Abstract: Provided herein is a reactive pillow comprising: a pressure sensor mat (11) including a first electrode fabric layer (20) having a plurality of first conductive portions (13) and a plurality of first non-conductive portions; a second electrode fabric layer (21) having a plurality of second conductive portions (14) and a plurality of second non-conductive portions; and a piezoresistive fabric layer (24) having a sheet resistance of at least 50K ohm/square; an actuator (40) comprising a plurality of first airbags (41, 42, 43) and a second airbag (44), each of the airbags (41, 42, 43, 44) having an inflated configuration corresponding to an increase in the volume of the airbags (41, 42, 43, 44) and a deflated configuration corresponding to a decrease in the volume of the airbags (41, 42, 43, 44); a controller communicating with the pressure sensor mat (11) and the actuator (40) communicating with the controller to actuate the controller to convert the airbags (41, 42, 43, 44) between the inflated configuration aType: ApplicationFiled: October 8, 2021Publication date: November 30, 2023Inventors: Li FU, Yam CHONG, Chun Wah CHU, Chenmin LIU
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Publication number: 20230385084Abstract: A display device control method includes when an operation on an on-screen display (OSD) input device is received, determining whether a signal generated by operating the OSD input device is currently sent to an OSD system or an operating system (OS); and when the signal generated by operating the OSD input device is currently sent to the OS-system, switching, according to a control signal generated by the OSD input device, the control signal from being sent to the OSD system to being sent to the OS-system. This application further provides a display device.Type: ApplicationFiled: September 8, 2021Publication date: November 30, 2023Inventors: Wei Zhu, Xingyang Sun, Li Fu, Qinghai Liang, Chiahsing Chung
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Publication number: 20230338454Abstract: In one aspect, the present invention discloses a composition of forsythia suspensa component and an optional panax ginseng component that can be used safely, efficiently and consistently to achieve antiviral, antipyretic, anti-inflammatory and/or immunity boosting effects, including forsythin, forsythin derivatives, and the composition of forsythin and phillygenin for the prevention and treatment of diseases associated with human cytomegalovirus infection, such as simple human cytomegalovirus infection or for patients infected by human cytomegalovirus during prevention and treatment of cardiovascular and cerebrovascular diseases, tumors, bums or AIDS or during a process of organ transplantation or during the perinatal period. In another aspect, this application provides a process for preparing the composition of forsythia suspensa and panax ginseng components is simple, suitable for industrial production and easy to popularize.Type: ApplicationFiled: August 31, 2021Publication date: October 26, 2023Inventors: Shuo WANG, Li FU, Xue FENG, Yang LIU, Rongxin LIN, Jirui HOU, Mingming LU, Wenfei FU, Qi LU, Qingfeng ZHOU
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Patent number: 11796401Abstract: A pressure distribution mapping system includes a flexible M×N textile-based pressure sensor array. with first and second electrode textile layers and a piezoresistive fabric layer with a sheet resistance of at least 60 k-ohm/square positioned between the first and second electrode textile layers. Individual pressure sensors are formed by an intersection between a row electrically-conductive path and a column electrically-conductive path along with the portion of the piezoresistive layer positioned at the intersection. A measurement system measures the resistance of each pressure sensor of the pressure sensor array. The measurement system includes a reading module with first op-amps connected to each row and second op-amps connected to each column.Type: GrantFiled: April 6, 2022Date of Patent: October 24, 2023Assignee: Nano and Advanced Materials Institute LimitedInventors: Yam Chong, Tao Xu, Li Fu, Chenmin Liu
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Publication number: 20230321125Abstract: In one aspect, a composition of ginsenoside Rg3 and ginsenoside Rg5 and a preparation method thereof, as well as its application in manufacturing drugs, foods and health products for boosting immunity, enhancing anti-tumor effects, improving resistance to anti-tumor targeted drugs, mitigating toxic and side effects of radiotherapy and chemotherapy or improving anti-fatigue effects. The composition has advantages in rapid action, less toxicity and side effects and is suitable for long-term use. In another aspect, a safe, highly efficient and stable drug, food or health product which can be obtained by a simple preparation process suitable for industrial production and which can be easily scaled up.Type: ApplicationFiled: August 20, 2021Publication date: October 12, 2023Inventors: Shou WANG, Li FU, Yang LIU, Mingming LU, Rongxin LIN, Wenfei FU, Xue FENG
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Publication number: 20230321137Abstract: A method of manufacturing a high molecular weight heparin (HMWH) compound is disclosed. The method comprises dissolving heparin to form a heparin solution and fractionating the heparin solution via tangential flow filtration (TFF) using a membrane with a molecular weight cut off (MWCO) between about 8 kDa and about 12 kDa. The TFF yields a retentate comprising fractionated heparin with a weight average molecular weight of about 20 kDa or greater, i.e., a high molecular weight heparin compound. A substantial proportion of heparin chains in the fractionated heparin may have a high molecular weight, e.g., 50% of the heparin chains or greater may have a molecular weight of 20 kDa or greater.Type: ApplicationFiled: June 12, 2023Publication date: October 12, 2023Applicant: NexEos Diagnostics, Inc.Inventors: Li FU, Zhenyu WANG, Jessica PAX
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Patent number: 11740143Abstract: The present disclosure provides a flexible pressure sensor array and method for fabricating the same. The pressure sensor array comprises a pressure-sensing substrate, top electrodes and bottom electrodes. The pressure-sensing substrate comprises a piezoresistive material, a fabric and pressure-sensing columns. The top electrodes and the bottom electrodes are attached to the pressure-sensing columns. The pressure sensor array is ultra-flexible and conforms to 3-dimensional surface for pressure monitoring.Type: GrantFiled: May 18, 2021Date of Patent: August 29, 2023Assignee: Nano and Advanced Materials Institute LimitedInventors: Li Fu, Tao Xu, Yam Chong
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Patent number: 11712447Abstract: A method of manufacturing a high molecular weight heparin (HMWH) compound is disclosed. The method comprises dissolving heparin to form a heparin solution and fractionating the heparin solution via tangential flow filtration (TFF) using a membrane with a molecular weight cut off (MWCO) between about 8 kDa and about 12 kDa. The TFF yields a retentate comprising fractionated heparin with a weight average molecular weight of about 20 kDa or greater, i.e., a high molecular weight heparin compound. A substantial proportion of heparin chains in the fractionated heparin may have a high molecular weight, e.g., 50% of the heparin chains or greater may have a molecular weight of 20 kDa or greater.Type: GrantFiled: May 12, 2022Date of Patent: August 1, 2023Assignee: NexEos Diagnostics, Inc.Inventors: Li Fu, Zhenyu Wang, Jessica Pax
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Publication number: 20230230950Abstract: A self-densifying interconnection is formed between a high-temperature semiconductor device selected from a GaN or SiC-based device and a substrate. The interconnection includes a matrix of micron-sized silver particles in an amount from approximately 10 to 60 weight percent; the micron-sized silver particles having a particle size ranging from approximately 0.1 microns to 15 microns. Bonding particles are used to chemically bind the matrix of micron-sized silver particles. The bonding particles are core silver nanoparticles with in-situ formed surface silver nanoparticles chemically bound to the surface of the core silver nanoparticles and, at the same time, chemically bound to the matrix of micron-sized silver particles. The bonding particles have a core particle size ranging from approximately 10 to approximately 100 nanometers while the in-situ formed surface silver nanoparticles have a particle size of approximately 3-9 nanometers.Type: ApplicationFiled: January 12, 2023Publication date: July 20, 2023Inventors: Yuechen WANG, Tao XU, Li FU
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Publication number: 20230151400Abstract: The present disclosure relates to synthesis of heparin, which may be bioequivalent to porcine USP Heparin Sodium. The synthesis may involve three intermediates starting from heparosan.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Applicant: Rensselaer Polytechnic InstituteInventors: Marc DOUAISI, Navdeep GROVER, Payel DATTA, Elena PASKALEVA, Lei LIN, Paul BRODFUEHRER, Trevor J. SIMMONS, Akihiro ONISHI, Makoto HIRAKANE, Li FU, Kevin LI, Robert J. LINHARDT, Jonathan DORDICK, Daisuke MORI
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Publication number: 20230101803Abstract: The present invention provides a use of a phillyrin/phillygenin composition which targets and inhibits 3CLpro protein of COVID-19 virus, in preparation of an anti-coronavirus drug or a drug for treating a disease caused by the coronavirus, wherein the coronavirus is COVID-19 virus, and the disease caused by the coronavirus is COVID-19.Type: ApplicationFiled: February 9, 2021Publication date: March 30, 2023Inventors: Zifeng YANG, Li FU, Ge JIANG, Nanshan ZHONG, Wei YANG, Qinhai MA, Min HUI, Chufang LI, Shuo WANG, Weiyi PAN, Qi LU, Aiai SONG, Jirui HOU, Runfeng LI, Mingming LU, Yingping WANG, Yang LIU, Guoyou LIU, Wenfei FU, Xue FENG, Qingfeng ZHOU, Xiaofeng YI, Rongxin LIN, Yu ZHANG
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Publication number: 20230075072Abstract: A binocular telescope includes a pair of Schmidt-Pechan roof prisms, a second half pentaprism, a right-angle prism, a main circuit board, and an auxiliary circuit board. The second half pentaprism is connected to a first lateral surface of one of the first half pentaprisms. A second lateral surface of the second half pentaprism substantially faces the other first half pentaprism. The third lateral surface of the right-angle prism is connected to the second lateral surface of the second half pentaprism. A normal of the fourth lateral surface of the right-angle prism is perpendicular to an imaginary plane. The imaginary plane includes a normal of the first lateral surface and a normal of the second lateral surface. The light emitter and the light receiver on the auxiliary circuit board are arranged above the fourth lateral surface of the right-angle prism and electrically connected with the main circuit board respectively.Type: ApplicationFiled: December 1, 2021Publication date: March 9, 2023Inventors: Li-Fu Chuang, Ping Long
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Patent number: 11591628Abstract: The present disclosure relates to synthesis of heparin, which may be bioequivalent to porcine USP Heparin Sodium. The synthesis may involve three intermediates starting from heparosan.Type: GrantFiled: September 7, 2017Date of Patent: February 28, 2023Assignee: Rensselaer Polytechnic InstituteInventors: Marc Douaisi, Navdeep Grover, Payel Datta, Elena Paskaleva, Lei Lin, Paul Brodfuehrer, Trevor J. Simmons, Akihiro Onishi, Makoto Hirakane, Li Fu, Kevin Li, Robert J. Linhardt, Jonathan Dordick, Daisuke Mori