Patents by Inventor Li-Jen Chuang

Li-Jen Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11954025
    Abstract: Disclosed herein includes a system, a method, and a device for reading and writing sparse data in a neural network accelerator. A mask identifying byte positions within a data word having non-zero values in memory can be accessed. Each bit of the mask can have a first value or a second value, the first value indicating that a byte of the data word corresponds to a non-zero byte value, the second value indicating that the byte of the data word corresponds to a zero byte value. The data word can be modified to have non-zero byte values stored at an end of a first side of the data word in the memory, and any zero byte values stored in a remainder of the data word. The modified data word can be written to the memory via at least a first slice of a plurality of slices that is configured to access the first side of the data word in the memory.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: April 9, 2024
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Ganesh Venkatesh, Liangzhen Lai, Pierce I-Jen Chuang, Meng Li
  • Publication number: 20240071911
    Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.
    Type: Application
    Filed: January 31, 2023
    Publication date: February 29, 2024
    Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Li-Feng Teng, Wei-Cheng Wu, Yu-Jen Wang
  • Patent number: 10158183
    Abstract: A method and a structure for positioning and wrapping wire leads involve providing two leads of a transmission wire for transmitting power and/or signal with appropriate orientational limit therebetween by: wrapping a predetermined range of the two leads extending from a predetermined object with one or more segments of strip-shaped net for orientational limit that maintain independent extension and juxtaposition of the two leads, so as to prevent the leads of the transmission wire from entwining with each other after frequent orientational change caused by an external force.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: December 18, 2018
    Assignee: Dragon Bite Industrial Co., Ltd.
    Inventor: Li-Jen Chuang
  • Patent number: 10118496
    Abstract: Upon completion of the manufacturing of constituent elements of the charging coupler, waterproof members each with a predetermined shape and width are integrally formed, made from an appropriate material, and disposed at a predetermined portion and/or segment of the constituent elements. In consequence, a hermetic seal is effectuated between each of the constituent elements of the waterproof members and a corresponding one of adjacent related elements of the charging coupler to therefore prevent any gap from forming in the charging coupler after long use, thereby preventing intrusion of ambient moisture.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: November 6, 2018
    Assignee: Dragon Bite Industrial Co., Ltd.
    Inventor: Li-Jen Chuang
  • Publication number: 20180269596
    Abstract: A method and a structure for positioning and wrapping wire leads involve providing two leads of a transmission wire for transmitting power and/or signal with appropriate orientational limit therebetween by: wrapping a predetermined range of the two leads extending from a predetermined object with one or more segments of strip-shaped net for orientational limit that maintain independent extension and juxtaposition of the two leads, so as to prevent the leads of the transmission wire from entwining with each other after frequent orientational change caused by an external force.
    Type: Application
    Filed: December 26, 2017
    Publication date: September 20, 2018
    Inventor: Li-Jen Chuang
  • Publication number: 20170225577
    Abstract: A waterproof mechanism of a charging coupler is provided and characterized in that: upon completion of the manufacturing of constituent elements of the charging coupler, waterproof members each with a predetermined shape and width are integrally formed, made from an appropriate material, and disposed at a predetermined portion and/or segment of the constituent elements, and in consequence a hermetic seal is effectuated between each of the constituent elements of the waterproof members and a corresponding one of adjacent related elements of the charging coupler to therefore prevent any gap from forming in the charging coupler after long use, thereby preventing intrusion of ambient moisture.
    Type: Application
    Filed: February 4, 2016
    Publication date: August 10, 2017
    Inventor: Li-Jen Chuang
  • Patent number: D768082
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: October 4, 2016
    Assignee: Dragon Bite Industrial Co., Ltd.
    Inventor: Li-Jen Chuang