Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A leadframe includes a peripheral frame, a plurality of lead pads, and a die attach pad (DAP). Each lead pad is physically connected to the peripheral frame by a respective connecting portion. The DAP is surrounded by the plurality of lead pads. The DAP includes a first protruding portion coupled to a first lead pad on a first side of the DAP and a second protruding portion coupled to a second lead pad on a second side of the DAP opposite the first side. The DAP does not comprise direct connections to the peripheral frame. The leadframe further includes two or more of the lead pads disposed on either side of the first lead pad on the first side of the DAP; and two or more of the lead pads disposed on either side of the second lead pad on the second side of the DAP.

Abstract: An electroencephalogram signal processing method includes a recording step, a retrieving step, a removing step and a synthesizing step. The recording step retrieves EEG signal components of a testee via a plurality of electrodes, wherein the EEG signal components serve as an input signal. The retrieving step filters the input signal to obtain a predetermined frequency band signal, and subtracts the predetermined frequency band signal from the input signal to obtain a difference signal. The removing step performs an independent component analysis operation between the difference signal and a separating matrix to obtain an analysis signal, generates a separating pseudo inverse and an independent analysis signal, and performs a matrix operation between the separating pseudo inverse and the independent analysis signal to obtain a corrected signal. The synthesizing step adds the corrected signal and the predetermined frequency band signal together to obtain an output signal.

Abstract: A calibrating and positioning structure of a scanning apparatus is provided. The scanning apparatus includes a scanning platform and a scanning window. The scanning window has a wide edge. The calibrating and positioning structure includes a calibrating part and at least one positioning part. The calibrating part is disposed on the scanning platform, and aligned with the wide edge of the scanning window. The at least one positioning part is partially overlapped with the calibrating part, wherein the positioning part is not aligned with the wide edge of the scanning window.

Abstract: An electroencephalogram signal processing method includes a recording step, a retrieving step, a removing step and a synthesizing step. The recording step retrieves EEG signal components of a testee via a plurality of electrodes, wherein the EEG signal components serve as an input signal. The retrieving step filters the input signal to obtain a predetermined frequency band signal, and subtracts the predetermined frequency band signal from the input signal to obtain a difference signal. The removing step performs an independent component analysis operation between the difference signal and a separating matrix to obtain an analysis signal, generates a separating pseudo inverse and an independent analysis signal, and performs a matrix operation between the separating pseudo inverse and the independent analysis signal to obtain a corrected signal. The synthesizing step adds the corrected signal and the predetermined frequency band signal together to obtain an output signal.

Abstract: A calibrating and positioning structure of a scanning apparatus is provided. The scanning apparatus includes a scanning platform and a scanning window. The scanning window has a wide edge. The calibrating and positioning structure includes a calibrating part and at least one positioning part. The calibrating part is disposed on the scanning platform, and aligned with the wide edge of the scanning window. The at least one positioning part is partially overlapped with the calibrating part, wherein the positioning part is not aligned with the wide edge of the scanning window.

Abstract: A dual-band inverted-F antenna is described. After being fed in by a signal feed-in portion, a first band signal and a second band signal are wirelessly sent from a first radiation portion and a second radiation portion of a radiation element in one aspect, and transmitted to a ground element through a short-circuit pin in another aspect, so as to achieve the dual-band effect. Meanwhile, a bent structure is designed on the short-circuit pin, such that when the short-circuit pin is employed by the dual-band inverted-F antenna to transmit signals, the interference on the signal transmission/reception of the radiation element will be reduced.

Abstract: A lens module structure includes an image sensing chip disposed on the first side of a substrate and electrically coupled to the substrate through wires. A memory chip and a control chip are soldered onto a second surface of the substrate, and a solderable output unit terminal is provided on one side of the second surface of the substrate for connecting to other electronic components. A lens pedestal is fastened onto the first surface of the substrate such that the image sensing chip is encapsulated within the lens pedestal, and an optical lens is provided within the lens pedestal and corresponding to the image sensing chip. In such way, the assembled components of the lens are decreased and the chips thereof are designed in a modular mode such that the overall volume of the lens is reduced and the surface mounting technologies can be omitted.