Abstract: A vehicle power management system and a power management method thereof are provided. The power management method includes: determining, by a microcontroller, whether or not a voltage of an ignition-off signal is less than a voltage threshold when the microcontroller receives the ignition-off signal; stopping a vehicle power supply from charging a backup battery, and using the vehicle power supply to charge a back-end load; activating a counter of the microcontroller; stopping the vehicle power supply from charging the back-end load, and using the backup battery to charge the back-end load when a counting time of the counter reaches a first time threshold; sending, by the microcontroller, the ignition-off signal to the back-end load when the counting time of the counter reaches a second time threshold; and stopping the backup battery from charging the back-end load when the counting time of the counter reaches a third time threshold.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: A method for performing a lithographic process over a semiconductor wafer is provided. The method includes coating a photoresist layer over a material layer which is formed on the semiconductor wafer in a track apparatus. The method further includes transferring the semiconductor wafer from the track apparatus to an exposure apparatus. The method also includes measuring a height of the photoresist layer before the removal of the semiconductor wafer from the track apparatus. In addition, the method includes measuring height of the material layer in the exposure apparatus. The method also includes determining a focal length for exposing the semiconductor wafer according to the height of the photoresist layer and the height of the material layer.

Abstract: A method for performing a lithographic process over a semiconductor wafer is provided. The method includes coating a photoresist layer over a material layer which is formed on the semiconductor wafer in a track apparatus. The method further includes transferring the semiconductor wafer from the track apparatus to an exposure apparatus. The method also includes measuring a height of the photoresist layer before the removal of the semiconductor wafer from the track apparatus. In addition, the method includes measuring height of the material layer in the exposure apparatus. The method also includes determining a focal length for exposing the semiconductor wafer according to the height of the photoresist layer and the height of the material layer.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.

Abstract: The present invention sets forth a method for supporting enhanced audio on a graphics processing unit (GPU) in a computing device having a graphics subsystem. In one embodiment, the method includes the steps of determining whether an option of a GPU audio output is enabled and the graphics subsystem and a first external output device is connected, and routing a first audio stream to the GPU of the graphics subsystem for processing when the option of the GPU audio output is enabled and the graphics subsystem and the first external output device is in connection and causing the processed first audio stream to be transferred along a first transmission path to the first external output device, or otherwise causing a second audio stream to be transferred along a second transmission path to a second external output device.

Abstract: The present invention sets forth a method and system for communicating with an external device through a processing unit in a graphics system of a computing device. In one embodiment, the method comprises allocating a first set of memory buffers having a first memory buffer and a second memory buffer in the graphics system based on an identification information of the external device, and invoking a first thread processor of the processing unit of the graphics system to perform services associated with a physical layer according to the identification information of the external device by storing a first data stream received from the external device through an I/O interface of the processing unit of the graphics system in the first memory buffer and retrieving a second data stream from the second memory buffer for transmission to the external device through the I/O interface.

Abstract: The present invention sets forth a method and a system for powering a graphics processing unit (GPU) with a power supply subsystem. In one embodiment, the method includes generating an offset in response to an operating voltage need of the GPU; and applying the offset to information associated with a first operating voltage of the GPU; wherein the offset causes the first operating voltage to change to a second operating voltage of the GPU.

Abstract: The present invention sets forth a method and a system for powering a graphics processing unit (GPU) with a power supply sybsystem. In one embodiment, the method includes generating an offset in response to an operating voltage need of the GPU; and applying the offset to information associated with a first operating voltage of the GPU; wherein the offset causes the first operating voltage to change to a second operating voltage of the GPU.

Abstract: The present invention sets forth a method and system for communicating with an external device through a processing unit in a graphics system of a computing device. In one embodiment, the method comprises allocating a first set of memory buffers having a first memory buffer and a second memory buffer in the graphics system based on an identification information of the external device, and invoking a first thread processor of the processing unit of the graphics system to perform services associated with a physical layer according to the identification information of the external device by storing a first data stream received from the external device through an I/O interface of the processing unit of the graphics system in the first memory buffer and retrieving a second data stream from the second memory buffer for transmission to the external device through the I/O interface.

Abstract: The present invention sets forth a method for supporting enhanced audio on a graphics processing unit (GPU) in a computing device having a graphics subsystem. In one embodiment, the method includes the steps of determining whether an option of a GPU audio output is enabled and the graphics subsystem and a first external output device is connected, and routing a first audio stream to the GPU of the graphics subsystem for processing when the option of the GPU audio output is enabled and the graphics subsystem and the first external output device is in connection and causing the processed first audio stream to be transferred along a first transmission path to the first external output device, or otherwise causing a second audio stream to be transferred along a second transmission path to a second external output device.