Abstract: A lighting module adapted for use in a keypad device includes a circuit substrate board, a transparent light guide plate stacked on the circuit substrate board, and at least one light emitting diode embedded in the light guide plate and connected electrically to the circuit substrate board. By having the light emitting diode embedded in the light guide plate, the overall thickness of the lighting module can be reduced to permit miniaturization.

Abstract: A lighting module adapted for use in a keypad device includes a circuit substrate board, a transparent light guide plate stacked on the circuit substrate board, and at least one light emitting diode embedded in the light guide plate and connected electrically to the circuit substrate board. By having the light emitting diode embedded in the light guide plate, the overall thickness of the lighting module can be reduced to permit miniaturization.

Abstract: A package structure for an image IC comprises a leadframe, a dam and a glass cap. The CMOS image IC is mounted on center of the leadframe and adhered to the leadframe. The bottom of the CMOS image IC is adhered to the leadframe by binding paste. The outer leads of the leadframe are electrically connected to corresponding bond pads of the CMOS image IC through metal wire. A rectangular dam is provided on the outer leads and around the leadframe. Furthermore, a glass cap is placed atop the dam to complete the package.

Abstract: A semiconductor packaging structure for packaging a semiconductor element comprises: a flat substrate having a chip seat and having a plurality of outer lead wires for electrically connecting the packaging element and the liner. A wall is formed by molding compound and is installed at periphery of the substrate in order to prevent the problem of mold flush in packaging. Bonding wires are connected on the element for electrically connecting the packaging element with outer circuits. The liner extending inwards and outwards than the wall with a predetermined distance to prevent that a mold flush problem will induce in the wall. Therefore, in the present invention, a wall is formed by molding compound for reducing cost and increasing the flexibility in utility.

Abstract: Disclosed is a packaging method of semiconductor device comprising the following step, preparing a PCB or BGA substrate with array-typed dam formed thereupon; placing a plurality of semiconductor devices into the array-typed dam, and attaching each semiconductor devices onto the dam grid; wire-bonding the semiconductor devices; performing lid-covering or resin-sealing process. The present invention forms the dam structure necessary for the package by an off-line process, and then attaches the dam structure on the substrate. Therefore, the problems of damage of PCB or substrate and short circuit due to the high-temperature and high-pressure pressing process can be prevented, moreover, the yield and the reliability can be enhanced.

Abstract: A method for semiconductor chip packaging comprises the following processes: preparing an array-typed base plane by pressing a plane-shaped material, wherein said array-typed base plane comprises a plurality of single-united base surrounded and defined by latticed dams; mounting a already-cut die to each said base unit on said array-typed base plane, and adhering said die to said base unit; wire-bonding said mounted die; applying adhesive paste to top surface of each said dam, and covering the resultant structure with a transparent lid to ensure the hermeticity of the package; cutting said array-typed base plane to a plurality of single-united base. By above-mentioned process, the manufacturing cost can be reduced and the yield can also be enhanced.