Patents by Inventor Li-Wei Hsu
Li-Wei Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240188130Abstract: Techniques pertaining to anti-motion and anti-interference frame exchange sequences in wireless communications are described. A station (STA), such as a Wi-Fi equipment, determines to enable a frame exchange sequence (FES). The STA then communicates with one or more other STAs by utilizing the FES in which preamble puncturing sounding and data transmission are performed in a same transmission opportunity (TXOP).Type: ApplicationFiled: October 4, 2023Publication date: June 6, 2024Inventors: Li-Chieh Chen, Kuo-Wei Chen, Chia-Jung Hsu, Yi-Hsuan Chung, Ming-Hsiang Tseng, Wei-Hsu Chen, Cheng-En Hsieh
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Patent number: 11996325Abstract: A device includes a substrate, a first dielectric layer over the substrate, a first conductive feature in the first dielectric layer, and an etch stop layer over the first dielectric layer. The etch stop layer includes metal-doped aluminum nitride. The device further includes a second dielectric layer over the etch stop layer, and a second conductive feature in the second dielectric layer. The second conductive feature extends into the etch stop layer and contacts the first conductive feature.Type: GrantFiled: July 29, 2020Date of Patent: May 28, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Ching Tsai, Yi-Wei Chiu, Li-Te Hsu
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Patent number: 11990339Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.Type: GrantFiled: August 2, 2021Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jian-Jou Lian, Yao-Wen Hsu, Neng-Jye Yang, Li-Min Chen, Chia-Wei Wu, Kuan-Lin Chen, Kuo Bin Huang
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Patent number: 11990167Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.Type: GrantFiled: June 21, 2021Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin, Li-Te Hsu, Han-Ting Tsai, Cheng-Yi Wu, Shih-Ho Lin
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Patent number: 11978664Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.Type: GrantFiled: July 29, 2022Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pang-Sheng Chang, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Li-Chieh Wu, Chun-Wei Hsu
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Patent number: 11969448Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.Type: GrantFiled: May 12, 2021Date of Patent: April 30, 2024Assignee: GENMONT BIOTECH INC.Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
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Patent number: 11974479Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.Type: GrantFiled: December 11, 2020Date of Patent: April 30, 2024Assignee: INNOLUX CORPORATIONInventors: Shun-Yuan Hu, Chin-Lung Ting, Li-Wei Mao, Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu, Ker-Yih Kao
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Publication number: 20240113112Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Inventors: Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang, Li-Wei Yin, Tzu-Wen Pan, Yi-Chun Chen
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Publication number: 20240095434Abstract: A method performed by at least one processor includes the following steps: generating a layout of an integrated circuit (IC), the layout comprising a cell and a layout context in a vicinity of the cell; receiving from a library a set of context groups and a set of timing tables, wherein each of the context groups is associated with one of the set of timing tables; determining a representative context group for the cell through comparing the layout context of the cell with the set of context groups; and performing a timing analysis on the layout according to a representative timing table associated with the representative context group for the cell.Type: ApplicationFiled: November 23, 2023Publication date: March 21, 2024Inventors: ZHE-WEI JIANG, JERRY CHANG JUI KAO, SUNG-YEN YEH, LI CHUNG HSU
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Publication number: 20240071947Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Yu-Ling Tsai, Lai Wei Chih, Meng-Tsan Lee, Hung-Pin Chang, Li-Han Hsu, Chien-Chia Chiu, Cheng-Hung Lin
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Publication number: 20070009965Abstract: The present invention provides a novel method of using an herbal chip for screening for candidate compounds as a GPCR agonist or antagonist from herbs by using a labeled anti-GPCR-GPCR as a probe for hybridization.Type: ApplicationFiled: December 29, 2004Publication date: January 11, 2007Applicant: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Chen-Hsiang Shen, Bang-Chi In
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Publication number: 20060263449Abstract: The present invention provides a method for treating arthritic disorders, skin inflammatory disorders and pain, comprising administering to a subject an extract of Andrographis paniculata Nees, and also provides a herbal composition used therefor that comprises the extract of Andrographis paniculata Nees.Type: ApplicationFiled: May 20, 2005Publication date: November 23, 2006Applicant: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Kuo-Sheng Chuang, Hsuan-Yi Lin, Jyh-chong Chen
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Publication number: 20060105967Abstract: The use of flavone derivatives of formula (I) in which R1, R2, R3, R4 and R5 independently represent hydrogen, hydroxy or an ester group; R6 represents hydrogen, hydroxy, an ester group or an O-glycoside group such as O-rhamnose, O-glucoside, O-retinoside or O-xyloside; and represents a single bond or a double bond; or the pharmaceutically acceptable salts thereof as TNF? antagonists or inhibitors.Type: ApplicationFiled: November 18, 2004Publication date: May 18, 2006Applicant: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Chen-Hsiang Shen, Yuan-Xiu Liao, Kuo-Sheng Chuang
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Publication number: 20060106098Abstract: The present invention relates to andrographolide and its derivatives of the general formula (I), as well as the stereoisomers and salts of andrographolide and the derivatives. Andrographolide and its derivatives represented by general formula (I) defined above are useful as TNF? (tumor necrosis factor alpha) antagonists or inhibitors which have inhibitory effect on the binding of TNF? to TNF-RI. Andrographolide exhibited inhibitor activity with IC50 values 60 ?M on L929 cell proliferation/cytotoxicity assay without cell cytotoxicity. In addition, in the animal model test of collagen-induced arthritis, andrographolide exhibited 50% paw edema. Andrographolide and its derivatives are promising sources with high TNF?-inhibiting or antagonizing activity.Type: ApplicationFiled: November 18, 2004Publication date: May 18, 2006Applicant: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Chen-Hsiang Shen, Kuo-Sheng Chuang
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Patent number: 6930097Abstract: A compound of formula 1-[3,4-dihydroxy-5-(2-hydroxyethyl)tetrahydrofuran-2-yl]pryimidine-2,4(1H,3H)-dione has inhibitory effects of matrix metalloproteinase-2 (gelatinase A) enzyme and binding of TNF? to TNF?-RI.Type: GrantFiled: April 21, 2003Date of Patent: August 16, 2005Assignee: Advanced Gene Technology Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Jeng-Woei Lee, Pang-Hsi Liu, Hui-Ping Lee, Yi-Ching Chen, Chun-Tsun Chen
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Patent number: 6908678Abstract: The present invention discloses a chemically surface-treated plastic slide that is useful for the immobilization of proteins, peptides or small molecules to its surface for the fabrication of biochips. Also disclosed in the present invention is a surface-treated plastic slide made of polystyrene, which is useful for the immobilization of oligonucleotides or polynucleotides to its treated surface for the fabrication of DNA chips.Type: GrantFiled: January 18, 2002Date of Patent: June 21, 2005Assignee: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Jyh-Phen Chen, Jeng-Woei Lee
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Patent number: 6884627Abstract: The present invention discloses a method for ascertaining the quality of herbs by applying the techniques of biochip for detecting the presence of biologically active, desired ingredient(s) in the herbs.Type: GrantFiled: April 5, 2002Date of Patent: April 26, 2005Assignee: Advanced Gene Technology, Corp.Inventors: Li-Wei Hsu, Su-Chen Chang
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Patent number: 6855343Abstract: The present invention relates to a novel method useful for fast separation and quick identification of active ingredients in herbs. The separation procedures are efficient without tedious and time-consuming works by using chromatographies or HPLC. The present invention further relates to a method for ascertaining the quality of herbs by applying treated plastic slides on quality control of herbal fractions, based on identification of their biological activities.Type: GrantFiled: May 21, 2002Date of Patent: February 15, 2005Assignee: Advanced Gene Technology, CorpInventors: Li-Wei Hsu, Su-Chen Chang
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Publication number: 20040043478Abstract: The present invention relates to a plastic slide which after being chemically surface-treated is useful for the immobilization of proteins, peptides or small molecules to its treated surface and thus is useful in the fabrication of biochips. The plastic slide has at least one cavity chamber, wherein the depth of the cavity chambers may be the same or different and generally ranges from less than about 0.1 mm to up to about 0.5 mm. The present invention also relates to a plastic slide made of polystyrene, which after being surface-treated is useful for the immobilization of oligonucleotides or polynucleotides to its treated surface and thus is useful in the fabrication of DNA chips.Type: ApplicationFiled: August 29, 2002Publication date: March 4, 2004Inventors: Li-Wei Hsu, Su-Chen Chang
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Patent number: 6683060Abstract: The invention discloses methods of treatment and prevention for TNF&agr;-related disorders and MMP-related disorders and compounds useful in such treatments. In particular, the invention dislcoses pharmaceutical compositions comprising a compound of the general formula: wherein X is a Zn(II) chelating group and selected from the group consisting of (CH2)nOH, (CH2)nNH2, (CH2)nSH, (CH2)mCOOH, (CH2)mCOOR, (CH2)mCONH2, (CH2)m″CONH—OH, (CH2)m″CONH—R, and (CH2)n′O(PO3)m″(m″+1), wherein n=2, 3, 4, or 5, n′=2 or 3, m=1, 2, 3, or 4, m′=1, 2, 3, 4, 5, or 6, m″=1, 2, 3, and R=—Cm′, H2m′+1 or aryl groups, especially 1-[3,4-dihydroxy-5-(2-hydroxyethyl)-tetrahydrofuran-2-yl]pyrimidine-2,4(1H,3H)-dione, which has an inhibitory effect on matrix metalloproteinase-2 (gelatinase A) and on the binding of TNF&agr; to TNF&agr;-RI.Type: GrantFiled: February 25, 2002Date of Patent: January 27, 2004Assignee: Advanced Gene Technology Corp.Inventors: Li-Wei Hsu, Su-Chen Chang, Jeng-Woei Lee, Pang-Hsi Liu, Hui-Ping Lee, Yi-Ching Chen, Chun-Tsun Chen