Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.

Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: An optical fingerprint sensing module includes an image sensing device, a light source and a light shielding structure. The image sensing device is configured to sense light transmitted from a fingerprint of a finger on a display panel. The image sensing device includes a light sensing plane having a first geometric center. The light source includes a light emitting plane having a second geometric center. The first geometric center is separated from the second geometric center by a distance from 2 mm to 20 mm. The light shielding structure is disposed between the image sensing device and the light source. In examples, the optical fingerprint sensing module further includes a field angle controller to constrain light pass there through with a field angle of 5-60 degrees. A display device including an optical fingerprint sensing module is disclosed herein as well.

Abstract: A wireless communication system having a dual-band coexistence architecture is provided, and the system includes a processing circuit, a first transceiver, a first front-end module, a first switch circuit, a first filter, a second filter, a second switch circuit, a first antenna, a second transceiver, a second front-end module, a third switch circuit, a third filter, a fourth filter, a fourth switch circuit and a second antenna. The first filter and the second filter use a combination of a wideband filter and a narrowband filter, and the fourth filter and the third filter also use a combination of a wideband filter and a narrowband filter, so as to achieve the dual-band coexistence architecture.

Abstract: A wireless communication system having a dual-band coexistence architecture is provided, and the system includes a processing circuit, a first transceiver, a first front-end module, a first switch circuit, a first filter, a second filter, a second switch circuit, a first antenna, a second transceiver, a second front-end module, a third switch circuit, a third filter, a fourth filter, a fourth switch circuit and a second antenna. The first filter and the second filter use a combination of a wideband filter and a narrowband filter, and the fourth filter and the third filter also use a combination of a wideband filter and a narrowband filter, so as to achieve the dual-band coexistence architecture.

Abstract: An optical device including a first substrate, a light source, a second substrate, an image capturing device, a lens module and a lens holder is provided. The light source outputs a first light beam. The second substrate includes a first surface and a second surface opposite to the first surface and closer to the first substrate. A scattered light beam which is generated by the first light beam entering an object touching the first surface of the second substrate and scattered in the object is a second light beam. The image capturing device receives a third light beam. The third light beam is the second light beam normally incident to the second surface and transmitted to the image capturing device. The lens module focuses the third light beam to be captured by the image capturing device. The lens holder is located between the light source and the image capturing device.

Abstract: An optical fingerprint sensing module includes an image sensing device, a light source and a light shielding structure. The image sensing device is configured to sense light transmitted from a fingerprint of a finger on a display panel. The image sensing device includes a light sensing plane having a first geometric center. The light source includes a light emitting plane having a second geometric center. The first geometric center is separated from the second geometric center by a distance from 2 mm to 20 mm. The light shielding structure is disposed between the image sensing device and the light source. In examples, the optical fingerprint sensing module further includes a field angle controller to constrain light pass there through with a field angle of 5-60 degrees. A display device including an optical fingerprint sensing module is disclosed herein as well.

Abstract: An embodiment of the invention provides an optical device including a first substrate, a light source, a second substrate, an image capturing device, a lens module and a lens holder. The light source outputs a first light beam. The second substrate includes a first surface and a second surface opposite to the first surface and closer to the first substrate. A scattered light beam which is generated by the first light beam entering an object touching the first surface of the second substrate and scattered in the object is a second light beam. The image capturing device receives a third light beam. The third light beam is the second light beam normally incident to the second surface and transmitted to the image capturing device. The lens module focuses the third light beam to be captured by the image capturing device.

Abstract: An optical device including a first substrate, a light source, a second substrate, an image capturing device, a lens module and a lens holder is provided. The light source outputs a first light beam. The second substrate includes a first surface and a second surface opposite to the first surface and closer to the first substrate. A scattered light beam which is generated by the first light beam entering an object touching the first surface of the second substrate and scattered in the object is a second light beam. The image capturing device receives a third light beam. The third light beam is the second light beam normally incident to the second surface and transmitted to the image capturing device. The lens module focuses the third light beam to be captured by the image capturing device. The lens holder is located between the light source and the image capturing device.

Abstract: An optical device including a first substrate, a light source, a second substrate, an image capturing device, a microstructure layer, and an infrared pass layer is provided. The light source is disposed on the first substrate. The second substrate is disposed above the first substrate. The second substrate includes a first surface and a second surface opposite to the first surface. The image capturing device is disposed on the first substrate to receive a light beam, which is originated from scattered light beams scattered by an object touching the first surface of the second substrate. The microstructure layer is disposed on the first surface of the second substrate. The microstructure layer is adapted to increase a light beam, which is scattered by the object and transmitted to the image capturing device. The infrared pass layer is adapted to pass the infrared light.

Abstract: An optical apparatus adapted to contact an object is provided. The optical apparatus includes an optical device and a processing circuit. The optical device includes a reflection structure and a transmission structure. The optical device senses light signals of the object via the reflection structure and the transmission structure. The processing circuit is electrically connected to the optical device. The processing circuit is configured to identify the object according to the light signals. In addition, a method for identifying an object is also provided.

Abstract: An optical apparatus adapted to contact an object is provided. The optical apparatus includes an optical device and a processing circuit. The optical device includes a reflection structure and a transmission structure. The optical device senses light signals of the object via the reflection structure and the transmission structure. The processing circuit is electrically connected to the optical device. The processing circuit is configured to identify the object according to the light signals. In addition, a method for identifying an object is also provided.

Abstract: An optical device including a first substrate, a light source, a second substrate, an image capturing device, a microstructure layer, and an infrared pass layer is provided. The light source is disposed on the first substrate. The second substrate is disposed above the first substrate. The second substrate includes a first surface and a second surface opposite to the first surface. The image capturing device is disposed on the first substrate to receive a light beam, which is originated from scattered light beams scattered by an object touching the first surface of the second substrate. The microstructure layer is disposed on the first surface of the second substrate. The microstructure layer is adapted to increase a light beam, which is scattered by the object and transmitted to the image capturing device. The infrared pass layer is adapted to pass the infrared light.

Abstract: A method for cleaning quartz reaction tube is disclosed. The method includes the steps of: introducing a quartz reaction tube to a cleaning chamber, wherein the quartz reaction tube comprises a first end and a second end; sealing the first end and the second end of the quartz reaction tube with a first sealing element and a second sealing element respectively, wherein the first sealing element is coupled to an input pipe and a cleaning rod, and the second sealing element is coupled to an output pipe; supplying a first cleaning agent into the quartz reaction tube from the input pipe; utilizing the cleaning rod to perform a cleaning process; and expelling the first cleaning agent from the output pipe.

Abstract: An antenna structure comprises a substrate, a first antenna unit and a second antenna unit. The substrate comprises a first surface and a second surface opposing the first surface. The first antenna unit is disposed on the first surface, and comprises at least a first slot with a wider inside and narrower outside at the edge of the first antenna unit. The second antenna unit is disposed on the second surface, and is connected to the first antenna unit through a hole in the substrate. The radius of the at least one first slot is one-fourth the wavelength of the central frequency of the antenna structure.

Abstract: A calibration device, capable of calibrating a gain of a radiometer, includes an actuator and a micro-electromechanical-system (MEMS) unit. The actuator receives a calibration signal outputted from a control unit. The MEMS unit is coupled to the actuator, in which the actuator enables the MEMS unit to shield an antenna of the radiometer according to the calibration signal, such that the radiometer generates an environmental signal according to an equivalent radiant temperature received from the MEMS unit, and the control unit calibrates the gain of the radiometer according to the environmental signal.

Abstract: An imaging system is provided, including a detection unit and a scan unit. The detection unit senses radiation of a target area. The scan unit directs the radiation to the detection unit, in which the scanning unit scans the target area N times at a constant speed within a scan period, such that each of the pixels of the target area is scanned N times by the scan unit, thereby the detection unit generates N sub-detection values for each of the pixels and adds the N sub-detection values up to generate a detection value for each of the pixels.