Patents by Inventor Liane Martinez

Liane Martinez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT SUBSTRATE WITH PLATED THROUGH HOLE STRUCTURE AND METHOD
    Publication number: 20080245555
    Abstract: A circuit substrate includes an outer plated through hole structure and an inner plated through hole structure located within the outer plated through hole structure. In one example, the circuit substrate includes a core and an outer plated through hole structure having a first metal layer configured over the core to form an outer plated through hole. The circuit substrate also includes an inner plated through hole structure located within the outer plated through hole structure having a second metal layer positioned inside of the outer plated through hole with an insulation layer interposed between the first and second metal layers. Methods for making such a circuit substrate are also described.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Applicant: ATI Technologies ULC
    Inventors: Yue Li, Vincent Chan, Neil Mclellan, Liane Martinez